RO3006 High Frequency PCB Solutions for RF and Microwave Applications

August 2,2025

Introduction

RO3006 high frequency circuit materials are engineered for commercial microwave and RF systems, offering exceptional electrical and mechanical stability. These ceramic-filled PTFE composites maintain consistent dielectric properties across temperature variations, outperforming traditional PTFE glass materials.

Key Features

Stable Dielectric Constant: Dk of 6.15±0.15 for reliable signal transmission
Ultra-Low Signal Loss: Dissipation factor of 0.0020 at 10GHz
Thermal Stability: Low CTE (X/Y:17ppm/°C, Z:24ppm/°C) minimizes phase shift
Design Flexibility: Compatible with RO3000 Series for multilayer integration
Cost-Effective Performance: Advanced materials at competitive prices

PCB Capabilities

Board Types: Single/double-sided, multilayer, and hybrid configurations
Copper Options: 1oz (35µm) and 2oz (70µm) available
Thickness Range: 5mil to 60mil (0.127mm-1.524mm)
Panel Size: Up to 400mm × 500mm
Customization: Multiple solder mask colors and surface finishes (ENIG, HASL, immersion silver, etc.)

Applications

Automotive radar systems
GPS antennas
Cellular telecom power amplifiers
Wireless patch antennas
Direct broadcast satellites

Call to Action

Enhance your RF/microwave designs with RO3006's stable performance - contact us for your high-frequency PCB needs.