RO4730G3 High-Frequency PCB: Features, Capabilities & Applications for Antenna Designs

August 7,2025

Introduction

Rogers RO4730G3 laminates are a reliable, low-cost alternative to traditional PTFE-based materials, offering optimal mechanical and electrical properties for high-performance antenna applications. Fully compatible with FR-4 and lead-free processes, RO4730G3 eliminates the need for special PTFE treatments, reducing production costs while maintaining superior performance.

Key Features

Dielectric Constant: 3.0 (±0.05) for precise impedance control.
Low Loss: Dissipation factor of 0.0028 minimizes signal energy loss.
Thermal Stability: Low Z-axis CTE (35.2 ppm/°C) and TCDk (34 ppm/°C) ensure reliability under thermal stress.
High Tg: >280°C withstands extreme manufacturing and operational temperatures.

PCB Manufacturing Capabilities

Layer Options: Single, double, multi-layer, and hybrid configurations.
Copper Weights: 1oz (35µm) and 2oz (70µm).
Thickness Range: LoPro (5.7–60.7mil) and ED Copper (20–60mil).
Max Size: 400mm x 500mm.
Customization: Solder mask colors (green, black, blue, etc.) and finishes (ENIG, HASL, OSP, etc.).

Applications

Ideal for cellular base station antennas and other RF/high-frequency designs requiring cost-effective, high-performance materials.