Rogers AD250C High Frequency PCB - Low PIM Antenna Material for 5G and Wireless Applications

August 15, 2025

Introduction to AD250C High Frequency PCB

Rogers AD250C antenna laminates are high-performance materials engineered for modern wireless antenna applications. These PTFE-based, glass-reinforced laminates deliver controlled dielectric constant, low loss, and superior passive intermodulation (PIM) performance. The woven glass reinforcement improves circuit processability, supporting high-yield PCB manufacturing. Available with standard ED or reverse-treated ED copper foil, AD250C helps minimize circuit loss and enhance PIM performance.

Key Features of AD250C PCB

Extremely low loss tangent of 0.0013 at 10 GHz
Dielectric constant of 2.50 ±0.04 for precise signal control
Low-profile copper reduces conductive loss
Moisture absorption of only 0.04% for environmental stability
High copper peel strength of 14.8 lbs/in for improved durability

PCB Manufacturing Capabilities

We support single-sided, double-sided, multilayer, and hybrid PCBs using AD250C material. Standard thicknesses include 20 mil, 30 mil, and 60 mil. Finished copper weights of 1 oz and 2 oz are available. Maximum board size is 400mm x 500mm. Solder mask colors include green, black, blue, red, and yellow. Surface finish options: ENIG, HASL, immersion silver, immersion tin, OSP, ENEPIG, bare copper, and pure gold.

Applications

AD250C PCBs are ideal for:
Cellular base station antennas
Automotive telematics antenna systems
Commercial satellite radio antennas