TMM13i High Dk Ceramic Thermoset RF PCB Manufacturing Capabilities and Services

August 16, 2025

Introduction to Rogers TMM13i High Frequency PCBs

Rogers TMM13i is an isotropic thermoset microwave material engineered for high-reliability plated through-hole strip-line and micro-strip applications. This ceramic thermoset polymer composite combines the benefits of ceramic and PTFE substrates while supporting soft substrate processing techniques.

Key Features of TMM13i Laminates

Low thermal coefficient of dielectric constant: –70 ppm/°C for stable performance across temperatures
Isotropic CTE (19/19/20 ppm/°C in X/Y/Z) closely matched to copper for reliable PTH and minimal etch shrinkage
High dielectric constant: 12.85±0.35 enabling component miniaturization
Low dissipation factor: 0.0019 @ 10 GHz for reduced energy loss in microwave circuits

PCB Manufacturing Capabilities with TMM13i

We produce:
Single-layer, double-layer, multilayer, and hybrid PCBs
Copper weights: 1 oz (35 µm) and 2 oz (70 µm)
Dielectric thickness: 15 mil (0.381 mm) to 500 mil (12.7 mm)
Max board size: 400 mm x 500 mm
Solder mask colors: green, black, blue, yellow, red
Surface finishes: Bare copper, HASL, ENIG, OSP, immersion tin, immersion silver, ENEPIG, pure gold

Applications

TMM13i PCBs are ideal for:
Chip testers
Dielectric polarizers
Lenses and filters
Couplers
RF and microwave circuits
Satellite communication systems

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