Rogers Kappa 438 High Frequency PCB Fabrication for Advanced Wireless and IoT Applications

August 24, 2025

Introduction

Rogers RO3010 represents a premium series of ceramic-filled PTFE composite materials engineered to deliver high dielectric constant with exceptional stability. These cost-effective laminates provide outstanding mechanical and electrical reliability, making them ideal for broadband component design and circuit miniaturization across diverse frequency applications.

Key Material Properties

High dielectric constant of 10.2±0.30 at 10 GHz ensures superior signal handling
Ultra-low dissipation factor of 0.0022 at 10 GHz minimizes signal loss
Low CTE values (X:13 ppm/°C, Y:11 ppm/°C, Z:16 ppm/°C) ensure exceptional dimensional stability
CTE closely matched to copper reduces phase shift under temperature variations
ISO 9001 certification guarantees consistent quality and reliability
Excellent suitability for complex multi-layer board designs

PCB Manufacturing Capabilities

Our RO3010 PCB fabrication services include
Single-layer, double-layer, multilayer and hybrid constructions
Copper weight options of 1 oz (35 μm) and 2 oz (70 μm)
Thickness selections: 5 mil (0.127 mm), 10 mil (0.254 mm), 25 mil (0.635 mm), 50 mil (1.27 mm)
Maximum board dimensions of 400 × 500 mm
Multiple solder mask colors including green, black, blue, yellow and red
Comprehensive surface finishes including ENIG, HASL, immersion silver, immersion tin, ENEPIG, OSP and pure gold

Applications

RO3010 circuit boards excel in high-frequency applications including
Automotive radar and collision avoidance systems
Global positioning satellite (GPS) antennas
Cellular telecommunications infrastructure
Patch antennas for wireless communications
Direct broadcast satellite systems
RF identification (RFID) systems
Microwave point-to-point connections

Utilize our manufacturing expertise for your high-frequency PCB requirements with Rogers RO3010 materials designed for superior performance in demanding RF and microwave applications.