AD255C High Frequency PCB Low Loss RF Laminate for Microwave and Telecom

August 25, 2025

Introduction to AD255C High Frequency PCB

Rogers AD255C laminates combine a fluoropolymer resin system, ceramic fillers, and fiberglass reinforcement to deliver superior performance in high-frequency applications. This advanced material offers reduced signal loss, low thermal expansion, and minimal passive intermodulation (PIM), making it an ideal choice for telecommunications infrastructure, microwave systems, and other RF applications.

Key Features of AD255C PCB

Very Low Loss PTFE and Ceramic Composite for minimal signal degradation
Exceptional Loss Tangent of 0.0014 at 10 GHz for efficient signal transmission
Stable Dielectric Constant of 2.55 for reliable electrical insulation
Low Profile Copper for improved conductivity and compact design
Low Z-Direction CTE (50 ppm/°C) for excellent thermal stability

PCB Manufacturing Capabilities

We support:
Double-sided, multi-layer, and hybrid PCBs
Copper weights: 1oz (35µm) and 2oz (70µm)
Dielectric thickness: 20mil (0.508mm) to 125mil (3.175mm)
Max PCB size: 400mm x 500mm
Solder mask colors: Green, Black, Blue, Yellow, Red, Purple, and more
Surface finishes: Immersion Gold, HASL, Immersion Silver, Immersion Tin, OSP, ENEPIG, Bare Copper, Pure Gold Plated, and others

Applications

AD255C PCBs are widely used in:
Cellular base station antennas
Automotive telematics antenna systems
Commercial satellite radio antennas

Thank you for reading. We look forward to serving your high-frequency PCB needs.