TFA300 High Frequency PTFE PCB Material for Aerospace and 5G Applications

August 31, 2025

Introduction

Wangling's TFA300 high-frequency material incorporates uniform special nano-ceramics mixed with PTFE resin, effectively eliminating fiberglass effects during electromagnetic wave propagation. Utilizing an advanced manufacturing and special lamination process, TFA300 delivers outstanding electrical, thermal, and mechanical performance. It serves as an aerospace-grade, high-reliability material capable of replacing similar imported products.

Key Features

Low Dk: 3.0 @ 10GHz for minimal signal delay and precise impedance control in 5G, radar, and mmWave circuits.
Ultra-Low Loss: Dissipation factor of 0.001 ensures high signal integrity for RF/microwave PCBs and antennas.
Excellent TCDk: -8 ppm/°C offers exceptional Dk stability across -40°C to +150°C, ideal for automotive, aerospace, and telecom.
High Peel Strength: >1.6N/mm improves copper adhesion and reduces delamination in multilayer boards.
Matched CTE: X/Y-axis CTE of 18 ppm/°C (close to copper’s 17 ppm/°C) minimizes thermal stress; Z-axis CTE of 30 ppm/°C ensures reliable PTH integrity.
Low Water Absorption: 0.04% for humid environments.
High Thermal Conductivity: 0.8 W/m/K for improved heat dissipation.
Flammability Rating: Complies with UL 94 V-0.

PCB Manufacturing Capabilities

We provide full customization for TFA300 PCBs:
Layer Count: Single-sided, Double-sided, Multi-layer, Hybrid (mixed materials)
Copper Weight: 1oz (35µm), 2oz (70µm)
Dielectric Thickness: 5mil (0.127mm) to 250mil (6.35mm)
Max PCB Size: 400mm x 500mm
Solder Mask Colors: Green, Black, Blue, Yellow, Red, and more
Surface Finishes: Immersion Gold (ENIG), HASL (Lead-Free), Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare Copper, Pure Gold

Applications

TFA300 is ideal for aerospace and aviation systems, phased-array antennas, airborne radar, satellite communication, navigation, and other high-frequency high-reliability applications.

Thank you for your interest.