RO3206 High Frequency PCB Materials for RF and Microwave Applications

August 30, 2025

Introduction

RO3206 is a high-frequency circuit material composed of ceramic-filled laminates reinforced with woven fiberglass. Designed as an enhanced extension of the RO3000 series, it offers exceptional electrical performance, improved mechanical stability, and competitive cost. Ideal for demanding RF and microwave applications.

Key Features & Benefits

Stable Dielectric Constant: 6.15 ± tight tolerance @ 10GHz/23°C ensures consistent signal performance.
Low Dissipation Factor: 0.0027 @ 10GHz reduces signal loss.
High Thermal Conductivity: 0.67 W/m/K for effective heat management.
Low Moisture Absorption: <0.1% for reliability in humid environments.
Matched CTE: 13/13/34 ppm/°C (x/y/z) ensures compatibility with multilayer and hybrid epoxy designs.
Woven Glass Reinforcement: Improves rigidity and handling during production.
Smooth Surface: Supports fine-line etching and high-precision circuitry.

PCB Manufacturing Capabilities

We provide full customization for RO3206 PCBs:
Layer Options: Single-sided, Double-sided, Multi-layer, Hybrid
Copper Weight: 1oz (35µm), 2oz (70µm)
Dielectric Thickness: 25mil (0.635mm), 50mil (1.27mm)
Max Board Size: 400mm x 500mm
Solder Mask Colors: Green, Black, Blue, Yellow, Red, and more
Surface Finishes: Immersion Gold, HASL, Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare Copper, Pure Gold

Applications

RO3206 is widely used in automotive GPS antennas, base station infrastructure, direct broadcast satellites, cable data links, microstrip patch antennas, and other RF/microwave systems.

Thank you for your interest.