What Are the Core Technical Differences Between FPC and PCB?
1. Fundamental Characteristics Flexible Printed Circuits (FPC) and Rigid Printed Circuit Boards (PCB) each have distinct advantages in electronic interconnection. FPC uses bendable polyimide film substrates, typically 0.05–0.3 mm thick, offering excellent dynamic flexing capabilities. PCB employs rigid FR-4 epoxy fiberglass substrates, with standard thicknesses ranging from 0.4 to 6.0 mm, providing superior structural support. 2.Key Performance Comparison Electrical Properties Mechanical Properties
![]() 3. Application Selection Guide When to Choose FPC When to Choose PCB
![]() 4.Technology Trends FPC is advancing toward finer line widths (<25 µm) and new flexible substrate materials. PCB is focusing on high thermal conductivity materials and microvia interconnect technology to meet increasing demands for heat dissipation and high-density connections. 5.Selection Recommendations When designing, consider the following factors: 6.Conclusion Rather than being mutually exclusive, FPC and PCB technologies are complementary. Many modern electronic devices use rigid-flex designs to leverage the strengths of both. |