High Frequency PCB: Rogers 60mil 1.524mm RO4350B Double-Sided RF Circuit Board for Patch Antenna
(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)
RO4350B hydrocarbon ceramic laminates are engineered to deliver exceptional high-frequency performance and cost-effective circuit fabrication. As operational frequencies reach 500 MHz and above, the range of laminates available to designers becomes significantly limited.
RO4350B material has the essential properties required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss enables the use of RO4350B in various applications where conventional circuit board materials are restricted due to higher operating frequencies.
The temperature coefficient of dielectric constant for RO4350B is one of the lowest among circuit board materials, and its dielectric constant remains stable across a wide frequency range.
The thermal coefficient of expansion (CTE) of RO4350B offers several advantages for PCB designers. Its expansion coefficient closely matches that of copper, which ensures excellent dimensional stability—a critical property for constructing mixed dielectric multilayer boards.
The low Z-axis CTE of RO4350B offers reliable plated through-hole quality, even in extreme thermal shock conditions. With a Tg exceeding 280°C, the expansion characteristics of RO4350B remain stable throughout the entire range of PCB processing temperatures.
RO4350B PCB Specifications
High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB |
|
PCB SIZE |
135 x 135mm=1PCS |
BOARD TYPE |
High frequency PCB, RF PCB |
Number of Layers |
Double sided PCB |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 35um(1oz)+PLATE |
RO4350B 60mil |
|
copper ------- 35um(1oz)+PLATE |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
11mil/12mil |
Minimum / Maximum Holes: |
0.3/2.2mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
184 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control |
NO |
BOARD MATERIAL |
|
Glass Epoxy: |
RO4350B 60mil, Tg 288℃ |
Final foil external: |
1.5oz |
Final foil internal: |
0oz |
Final height of PCB: |
1.6mm ±0.16 |
PLATING AND COATING |
|
Surface Finish: |
Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel) |
Solder Mask Apply To: |
NO |
Solder Mask Color: |
NO |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend: |
NO |
Colour of Component Legend: |
NO |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated Through Hole(PTH) |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" (0.15mm) |
Board plating: |
0.0030" (0.076mm) |
Drill tolerance: |
0.002" (0.05mm) |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Typical Applications Include:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power Amplifiers
RFID
Data Sheet for Rogers 4350B (RO4350B)
RO4350B Typical Value |
|||||
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255 |
|
MPa |
|
IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10 |
X |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
|
℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
|
℃ TGA |
|
ASTM D 3850 |
Thermal Conductivity |
0.69 |
|
W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
|
% |
48hrs immersion 0.060" |
ASTM D 570 |
Density |
1.86 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88 |
|
N/mm |
after solder float 1 oz. |
IPC-TM-650 2.4.8 |
Flammability |
(3)V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
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