Home > Hybrid PCB > Hybrid PCB Mixed Material Circuit Board Different Materials Combined PCB RO4350B + FR4 + RT/duroid 5880 with Immersion Gold
Hybrid PCB Mixed Material Circuit Board Different Materials Combined PCB RO4350B + FR4 + RT/duroid 5880 with Immersion Gold

(PCBs are custom-made products, the picture and parameters shown are just for reference)


Introduction

Hello Everyone,
Today, we will discuss hybrid PCBs, specifically those that integrate high-frequency materials with epoxy glass.


Understanding Hybrid PCB Structure

Let’s examine the stack-up to grasp the hybrid configuration:


Layer 1 to layer 2 is the core of RO4350B high frequency material and layer 3 to layer 4 is the core of FR-4 epoxy glass. The 2 cores are bonded by a sheet of adhesive (prepreg).


Types of Hybrid PCB

Hybrid PCBs can combine FR-4 with high-frequency materials, as mentioned above. Another type is a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.



Reasons to Use Hybrid PCBs

There are three primary reasons to opt for high-frequency multilayer PCBs: cost-effectiveness, enhanced reliability, and improved electrical performance.

1.Cost Efficiency: High-frequency materials are generally more expensive than FR-4. By using a hybrid of FR-4 and high-frequency materials, manufacturers can address cost concerns effectively.
2.Reliability Improvement: High Coefficient of Thermal Expansion (CTE) values in PCB materials can lead to reliability issues. Combining low CTE FR-4 with higher CTE materials results in an acceptable composite CTE, thereby enhancing reliability.
3.Tailored Electrical Performance: Different sections of a mixed PCB may require varying levels of electrical performance. For areas needing high performance, high-frequency materials are employed, while less demanding sections can use FR-4. Additionally, using materials with different DK values can improve electrical properties, particularly in combiners and filters.



Why Choose FR-4?

The combination of FR-4 and high-frequency materials is increasingly popular because FR-4 and the vast majority of high frequency materials have little compatibility problems.


To ensure reliable lamination, we select a prepreg sheet of high-frequency material and apply the appropriate pressing cycle. Using an adhesive layer made from the same material simplifies the pressing process.


Our PCB Capability (Hybrid PCB)

PCB Type:

Hybrid PCB, Mixed PCB

Hybrid type:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4;

RT/duroid5880 + RO4350B

RO3000 Series + FR4

RT/duroid +FR4

Solder mask:

Green, Red, Blue, Black, Yellow

Layer count:

4 Layer, 6 Layer, Multilayer

Copper weight:

1oz (35µm), 2oz (70µm)

PCB thickness:

1.0-10mm

PCB size:

≤400mm X 500mm

Surface finish:

Bare copper, HASL, ENIG, Immersion tin, Immersion silver, OSP, ENEPIG, Pure gold


Thank you for reading! Feel free to contact us for any PCB inquiries.


Next Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880