Advanced 4-Layer HDI PCB with RO4003C Material for High-Frequency Applications

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Introduction to RO4003C

Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material that offers the electrical performance of PTFE combined with the manufacturability of epoxy/glass. This material is specifically designed for high-frequency applications, providing low dielectric loss and tight control over dielectric constant (Dk). Unlike traditional microwave laminates, RO4003C does not require special handling or treatments for through-holes, making it a cost-effective solution for RF microwave circuit designs.

Key Features of RO4003C

Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m·K
Thermal Coefficient of Dk: +40 ppm/°C (range: -50°C to 150°C)
CTE Matched to Copper: 11 ppm/°C (X-axis), 14 ppm/°C (Y-axis)
Low Z-Axis CTE: 46 ppm/°C
Tg: >280°C
Low Moisture Absorption: 0.06%

PCB Construction Details

}.\]Bottom Silkscreen<\/td>.\]Top Solder Mask<\/td>}.\]Bottom Solder Mask<\/td>}.\]Electrical Testing<\/td>

Parameter	Details
Base Material<\/td>	RO4003C<\/td>
Layer Count<\/td>	4 layers<\/td>
Board Dimensions<\/td>	95.89 mm x 55.87 mm (1 PCS, ± 0.15 mm)<\/td>
Minimum Trace/Space<\/td>	4/5 mils<\/td>
Minimum Hole Size<\/td>	0.3 mm<\/td>
Blind & Buried Vias<\/td>	Layer 3 - Layer 4, Layer 2 - Layer 3<\/td>
Finished Board Thickness<\/td>	0.85 mm<\/td>
Finished Copper Weight<\/td>	1 oz (1.4 mils) for both inner and outer layers<\/td>
Via Plating Thickness<\/td>	20 µm<\/td>
Surface Finish<\/td>	Immersion silver<\/td>
Top Silkscreen<\/td>	White<\/td>
None<\/td>
Green<\/td>
None<\/td>
100% before shipment<\/td>

PCB Stackup

}.\]Copper Layer 1<\/td>}.\]Rogers 4003C Core<\/td>}.\]Copper Layer 2<\/td>}.\]RO4450F Bondply<\/td>}.\]Copper Layer 3<\/td>}.\]Rogers 4003C Core<\/td>}.\]Copper Layer 4<\/td>

Layer	Details
35 µm<\/td>
0.203 mm (8 mil)<\/td>
35 µm<\/td>
0.101 mm (4 mil)*<\/td>
35 µm<\/td>
0.406 mm (16 mil)<\/td>
35 µm<\/td>

PCB Statistics

Components: 24
Total Pads: 55
Thru Hole Pads: 43
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 23
Nets: 5

Artwork and Standards

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Benefits of RO4003C

Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower fabrication costs
Designed for performance-sensitive, high-volume applications
Competitively priced

Applications

Cellular Base Station Antennas
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites