* PCBs are custom-made, picture & parameters for reference
Advanced 4-Layer HDI PCB with RO4003C Material for High-Frequency Applications
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to RO4003C
Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material that offers the electrical performance of PTFE combined with the manufacturability of epoxy/glass. This material is specifically designed for high-frequency applications, providing low dielectric loss and tight control over dielectric constant (Dk). Unlike traditional microwave laminates, RO4003C does not require special handling or treatments for through-holes, making it a cost-effective solution for RF microwave circuit designs.
Key Features of RO4003C
Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m·K
Thermal Coefficient of Dk: +40 ppm/°C (range: -50°C to 150°C)
CTE Matched to Copper: 11 ppm/°C (X-axis), 14 ppm/°C (Y-axis)
Low Z-Axis CTE: 46 ppm/°C
Tg: >280°C
Low Moisture Absorption: 0.06%
PCB Construction Details
| Parameter | Details |
|---|---|
| Base Material | RO4003C |
| Layer Count | 4 layers |
| Board Dimensions | 95.89 mm x 55.87 mm (1 PCS, ± 0.15 mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3 mm |
| Blind & Buried Vias | Layer 3 - Layer 4, Layer 2 - Layer 3 |
| Finished Board Thickness | 0.85 mm |
| Finished Copper Weight | 1 oz (1.4 mils) for both inner and outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion silver |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Green |
| Bottom Solder Mask | None |
| Electrical Testing | 100% before shipment |
PCB Stackup
| Layer | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| Rogers 4003C Core | 0.203 mm (8 mil) |
| Copper Layer 2 | 35 µm |
| RO4450F Bondply | 0.101 mm (4 mil)* |
| Copper Layer 3 | 35 µm |
| Rogers 4003C Core | 0.406 mm (16 mil) |
| Copper Layer 4 | 35 µm |
PCB Statistics
Components: 24
Total Pads: 55
Thru Hole Pads: 43
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 23
Nets: 5
Artwork and Standards
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Benefits of RO4003C
Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower fabrication costs
Designed for performance-sensitive, high-volume applications
Competitively priced
Applications
Cellular Base Station Antennas
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites
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