Home > Multilayer High Frequency PCB > High Frequency HDI PCB > High-Performance 4-Layer HDI PCB Using RO4350B Material
4-Layer HDI PCB RO4350B
Material:Rogers RO4350B / Hydrocarbon/Ceramic
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal

* PCBs are custom-made, picture & parameters for reference

High-Performance 4-Layer HDI PCB Using RO4350B Material


(Custom PCBs are tailored products; the images and specifications provided are for reference only.)


Introduction to RO4350B

Rogers RO4350B is a proprietary woven glass reinforced hydrocarbon/ceramic material that offers electrical performance comparable to PTFE combined with the manufacturability of epoxy/glass. This material is designed for high-frequency applications, providing low dielectric loss and tight control over dielectric constant (Dk). Unlike traditional microwave laminates, RO4350B does not require special handling or treatments for through-holes, making it a cost-effective solution for RF designs.


Key Features of RO4350B

Dielectric Constant (Dk): 3.48 ± 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Conductivity: 0.69 W/m·K
CTE: X-axis: 10 ppm/°C, Y-axis: 12 ppm/°C, Z-axis: 32 ppm/°C
Tg: >280°C
Low Water Absorption: 0.06%


PCB Construction Details

ParameterDetails
Base MaterialRO4350B
Layer Count4 layers
Board DimensionsOutline 1: 70 mm x 50 mm (1 PCS, ± 0.15 mm)
Outline 2: 70 mm x 40 mm
Minimum Trace/Space4/7 mils
Minimum Hole Size0.3 mm
Stepped OutlineYes
Finished Board Thickness0.5 mm
Finished Copper Weight1 oz (1.4 mils) for outer layers
Via Plating Thickness20 µm
Blind and Buried ViasL1-L2, L1-L3, L2-L3
Surface FinishImmersion Gold
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Testing100% before shipment

PCB Stackup

LayerDetails
Copper Layer 135 µm
Rogers RO4350B Core0.762 mm (30 mil)
Copper Layer 235 µm
Prepreg (RO4450F)0.102 mm (4 mil)
Copper Layer 335 µm
Rogers RO4350B Core0.762 mm (30 mil)
Copper Layer 435 µm

PCB Statistics

Components: 9
Total Pads: 32
Thru Hole Pads: 17
Top SMT Pads: 15
Bottom SMT Pads: 0
Vias: 23
Nets: 4


RO4350B 4-Layer HDI PCB


Artwork and Standards

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


Benefits of RO4350B

Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower fabrication costs
Excellent dimensional stability
Competitively priced


Applications

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites


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