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Rogers RO4360G2 6-Layer High Frequency PCB
Material:Rogers RO4360G2 (Hydrocarbon Ceramic-filled Thermoset) / 8mil Core
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal

* PCBs are custom-made, picture & parameters for reference

Rogers RO4360 High Frequency PCB Based on 6-layer with 8mil Core Coating Immersion Gold for Small Cell Transceivers


(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)


Overview:

RO4360G2 laminates from Rogers Corporation are high-performance materials with a dielectric constant (Dk) of 6.15 and low loss properties. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials provide an ideal balance of performance and processing ease. RO4360G2 extends Rogers' portfolio by offering a lead-free process capable solution that enhances rigidity for improved manufacturability in multi-layer board constructions, while also reducing material and fabrication costs.


These laminates process similarly to FR-4 and are compatible with automated assembly. They feature a low Z-axis coefficient of thermal expansion (CTE) for design flexibility and share a high glass transition temperature (Tg) consistent with the entire RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminates in multi-layer designs.


With a Dk of 6.15 (Design Dk 6.4), RO4360G2 laminates allow designers to minimize circuit dimensions in applications where size and cost are critical. They are an excellent value choice for engineers working on designs such as power amplifiers, patch antennas, ground-based radar, and other general RF applications.


Rogers RO4360G2 6-Layer High Frequency PCB Top View


Features and Benefits

Thermoset Resin System
1.Specially formulated to meet 6.15 Dk
2.Ease of fabrication; processes similar to FR-4
3.Material repeatability
4.Low loss
5.High thermal conductivity
6.Lower total PCB cost compared to competing PTFE products


Low Z-axis CTE / High Tg
1.Design flexibility
2.Plated through-hole reliability
3.Compatible with automated assembly


Environmentally Friendly
1.Lead-free process compatible


Regional Finished Goods Inventory
1.Short lead times and quick inventory turns
2.Efficient supply chain management


Rogers RO4360G2 6-Layer High Frequency PCB Bottom View


Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers
Patch Antennas
Ground-Based Radar


PCB Capability

Click to expand/collapse the table

PCB Capability (RO4360G2)

PCB Material:

Hydrocarbon Ceramic-filled Thermoset Materials

Designation:

RO4360G2

Dielectric constant:

6.15 ±0.15

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP etc..


Stack Up

6-Layer Stackup of RO4360G2 RF PCB


Data Sheet of RO4360G2

Click to expand/collapse the table

RO4360G2 Typical Value

Property

RO4360G2

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

6.15±0.15

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

2.5 GHz/23℃

Dissipation Factor,tanδ

0.0038

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Conductivity

0.75

 

W/mK

50℃

ASTM D-5470

Volume Resistivity

4.0 X 1013

 

Ω.cm

Elevated T

IPC-TM-650 2.5.17.1

Surface Resistivity

9.0 X 1012

 

Ω

Elevated T

IPC-TM-650 2.5.17.1

Electrical Strength

784

Z

V/mil

 

IPC-TM-650 2.5.6.2

Tensile Strength

131 (19)     97(14)

X            Y

MPa (kpsi)

40 hrs 50%RH/23

ASTM D638

Flexural Strength

213(31)     145(21)

X            Y

Mpa (kpsi)

40 hrs 50%RH/23

IPC-TM-650, 2.4.4

Coefficient of Thermal Expansion

13                 14                        28

X              Y                    Z

ppm/℃

-50 ℃to 288℃ After Replicated Heat Cycle

IPC-TM-650, 2.1.41

Tg

>280

 

℃ TMA

 

IPC-TM-650 2.4.24.3

Td

407

 

 

ASTM D3850 using TGA

T288

>30

Z

min

30 min / 125℃ Prebake

IPC-TM-650 2.2.24.1

Moisture Absorption

0.08

 

%

50℃/48hr

IPC-TM-650 2.6.2.1 ASTM D570

Thermal Coefficient of er

-131 @10 GHz

Z

ppm/℃

-50℃ to 150℃

IPC-TM-650, 2.5.5.5

Density

2.16

 

gm/cm³

RT

ASTM D792

Copper Peel Strength

5.2 (0.91)

 

pli (N/mm)

Condition B

IPC-TM-650 2.4.8

Flammability

V-0

 

 

 

UL 94 File QMTS2. E102765


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