12-layer Through Holes PCB 1.6mm IT-180 Impedance Matt Red
1.Basic PCB Specifications
-Board Type: 12 Layers
-Material Type: IT-180A, FR-4 Tg 170°C
-Solder Mask: Both sides, Matt Red
-Silkscreen :Print Top side, White
-Surface Finish: ENIG
-Total Board Thickness: 1.6mm ± 10%
-Board Size: 80.15mm x 76.6mm (1 PCS)
-Minimum Hole Size: 0.2mm
-Solder Mask Thickness: 10µm
-Minimum Dielectric Thickness: 100µm
-Minimum Trace Line Width: 120µm
-Minimum Spacing :125µm
-Plated Through Holes: L1-L12
-Blind Vias: No
Impedance Control:
-50 Ohm Differential Pairs Top layer, 4mil/4mil trace/gap, Reference layer 2
-90 Ohm Differential Pairs Top layer, 5mil/6mil trace/gap, Reference layer 2
-100 Ohm Differential Pairs Top layer, 6mil/9mil trace/gap, Reference layer 2
-50 Ohm Differential Pairs Layer 3, 5mil/5mil trace/gap, Reference layers 2 & 4
-90 Ohm Differential Pairs Layer 5, 7mil/6mil trace/gap, Reference layers 4 & 6
-100 Ohm Differential Pairs Layer 8, 6mil/6mil trace/gap, Reference layers 7 & 9
All 0.2mm and 0.3mm vias are filled and capped according to IPC 4761 Type VII. Printing series number is required.
2.PCB Stack-up (Component Side at Top)
Type |
Layer No. |
Thickness (µm) |
Specification |
Copper |
1 |
45 |
18µm Base Copper + 25µm Plating |
FR-4 PP |
|
150 |
IPC-4101/24 |
Copper |
2 |
17 |
|
FR-4 IT-180 |
Core |
135 |
IPC-4101/24 |
Copper |
3 |
17 |
|
FR-4 PP |
|
153 |
IPC-4101/24 |
Copper |
4 |
17 |
|
FR-4 IT-180 |
Core |
115 |
IPC-4101/24 |
Copper |
5 |
17 |
|
FR-4 PP |
|
94 |
IPC-4101/24 |
Copper |
6 |
17 |
|
FR-4 IT-180 |
Core |
115 |
IPC-4101/24 |
Copper |
7 |
17 |
|
FR-4 PP |
|
94 |
IPC-4101/24 |
Copper |
8 |
17 |
|
FR-4 IT-180 |
Core |
115 |
IPC-4101/24 |
Copper |
9 |
17 |
|
FR-4 PP |
|
150 |
IPC-4101/24 |
Copper |
10 |
17 |
|
FR-4 IT-180 |
Core |
135 |
IPC-4101/24 |
Copper |
11 |
17 |
|
FR-4 PP |
|
150 |
IPC-4101/24 |
Copper |
12 |
45 |
18µm Base Copper + 25µm Plating |
3. PCB Statistics :
-Components :240
-Total Pads :482
-Thru Hole Pads :234
-Top SMT Pads :138
-Bottom SMT Pads: 110
-Vias :256
-Nets :10
4.Artwork and Quality
-Type of Artwork Supplied Gerber RS-274-X
-Quality Standard IPC-Class-2
-Availability Worldwide
5. Introduction to IT-180ATC
IT-180ATC is a high Tg (175°C by DSC) multifunctional filled epoxy, known for its high thermal reliability and CAF resistance. It is suitable for various applications and can withstand up to 260°C during lead-free assembly.
IPC-Class-2
6. Features of IT-180ATC
-Dielectric Constant (DK) 4.1 at 10GHz
-Dissipation Factor 0.017 at 10GHz
-Thermal Resistance T260 > 60 minutes, T288 > 20 minutes
-Peel Strength (Min.) Standard ED Copper, 8 lbs/inch
-CTE Matching to Copper X axis 11-13 ppm/°C, Y axis 13-15 ppm/°C
-Low Z-Axis Coefficient of Thermal Expansion 45 ppm/°C
-Tg > 175°C
-Low Moisture Absorption 0.1%
-UL 94-V0 Flammability Rating
7. Typical Applications
-Automotive Engine Room ECU
-Backplane
-Data Storage
-Server and Networking
-Telecommunication