TU-768 PCB 2-Layer 1.6mm Thick High-Performance Epoxy Laminates for Consumer Electronics

1. Introduction of TU-768

TUC's TU-768 and TU-768P laminates and prepregs are crafted from high-quality woven E-glass infused with an epoxy resin system. This design imparts UV-blocking characteristics and ensures compatibility with automated optical inspection (AOI) processes. These materials are ideal for circuit boards that must endure severe thermal cycles or extensive assembly procedures. TU-768 laminates demonstrate excellent coefficients of thermal expansion (CTE), superior chemical resistance, thermal stability, and resistance to conductive anodic filament (CAF) formation.

2. Typical Properties

- Glass transition temperature (Tg) measured by DSC is 180°C.
- Compatible with lead-free processing.
- Excellent thermal expansion coefficients: X-Axis of 11-15 ppm/°C and Y-Axis of 11-15 ppm/°C.
- Time to delaminate (copper removed) measured by TMA: T260 of 60 minutes and T288 of 15 minutes.
- Dielectric constant (DK) of 4.3 at both 5 GHz and 10 GHz, and ranges from 4.3 to 4.4 at 1 GHz.
- Dissipation factor (Df) or loss tangent: 0.023 at 10 GHz, 0.021 at 5 GHz, and between 0.019 and 0.018 at 1 GHz.
- Anti-CAF properties.
- Superior chemical and thermal resistance.
- Fluorescent properties suitable for AOI.
- Moisture absorption of 0.18%.
- Flammability rating (laminate and laminated prepreg) of UL94-V0.

3. PCB Stack-up: 2-layer Rigid PCB
- Copper Layer 1: 35 µm
- TU-768 Core: 1.5 mm (60 mil)
- Copper Layer 2: 35 µm

  4. PCB Construction Details
- Board dimensions: 110 mm x 197 mm = 1 piece, +/- 0.15 mm.
- Minimum trace/space: 4/4 mils.
- Minimum hole size: 0.3 mm.
- No blind vias.
- Finished board thickness: 1.6 mm.
- Finished copper weight: 1 oz (1.4 mils) on outer layers.
- Via plating thickness: 20 µm.
- Surface finish: Hot Air Solder Level (HASL).
- Top silkscreen: White.
- Bottom silkscreen: None.
- Top solder mask: Green.
- Bottom solder mask: Green.
- 100% electrical testing conducted prior to shipment.

 5. PCB Statistics:

- Components: 41.
- Total pads: 152.
- Through-hole pads: 97.
- Top SMT pads: 45.
- Bottom SMT pads: 0.
- Vias: 51.
- Nets: 2.

6. Type of Artwork Supplied:Gerber RS-274-X

7.Quality Standard:
IPC-Class-2

8. Availability: Worldwide

9. Some Typical Applications

- Consumer electronics.
- Servers and workstations.
- Automotive applications.