2-Layer Adhesiveless FPC 50μm ENIG for Flexible Electronics
1.Introduction of SF202 Adhesiveless PI Film Based FCCL
SF202 is an adhesiveless double-sided flexible copper-clad laminate developed by Shengyi Technology for high-reliability flexible electronic devices. It is specifically designed for high-frequency signal transmission and dynamic bending scenarios, and is applicable to fields with strict requirements for flexible printed circuits (FPC), such as foldable mobile phones, Computer, digital camera, VCR, flat panel display, automotive electronics, and apparatus and instrument. Its core advantages lie in low dielectric loss, high bending resistance, and excellent dimensional stability.
2.Key Features
Stable Dielectric Constant: Dk of 3.2 at 1 GHz by IPC-TM-650
Controlled Loss Characteristics: Dissipation factor of 0.007 at 1 GHz by IPC-TM650
Strong Bonding: Peel Strength 90° ≥1N/mm
Chemical Durability: Chemical Resistance ≥80%
Environmental Resistance: Moisture Absorption <1.5%
High Insulation: Dielectric Strength 150 V/μm
Environmental Safety: Halogen free, Flammability UL94 V-0
Overall Performance: Excellent flexibility, thermal resistance, dimensional and electrical properties
3.Benefits
Process Reliability: Excellent soldering reliability, dimensional stability and chemical resistance
Comprehensive Performance: Excellent mechanical and electrical properties
Environmental Compliance: Halogen free, Flammability UL94 VTM-0
Regulatory Compliance: Compatible with EU RoHS directive, free of Pb, Hg, Cd, Cr6+, PBB, PBDE, etc.
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | Adhesiveless Polyimide |
| Layer Count | 2 layers |
| Board Dimensions | 110mm × 130mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 8/6 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.12mm |
| Finished Cu Weight | 0.5oz (0.7 mils) outer layers |
| Via Plating Thickness | 15 μm |
| Surface Finish | ENIG |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1 - 22 μm
SF305 Polyimide Core - 0.05 mm (50μm)
Copper Layer 2 - 22 μm
6.PCB Statistics:
Components: 90
Total Pads: 179
Thru Hole Pads: 79
Top SMT Pads: 120
Bottom SMT Pads: 0
Vias: 51
Nets: 2
7.Typical Applications
Computer
Mobile phone
Digital camera, VCR
Automobile, Office Automatic equipment, etc.
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
