3 Layer RO3006 Hybrid RF PCB 0.86mm with Blind Vias for Microwave Applications
1.Introduction
Rogers RO3006 laminates are ceramic-filled PTFE composites engineered to deliver outstanding electrical and mechanical stability, making them ideal for commercial microwave and RF applications. These advanced circuit materials provide a consistent dielectric constant (Dk) across varying temperatures, eliminating the Dk shift commonly found in PTFE glass materials near room temperature.
The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20. The dielectric loss is low, and the loss increases as the frequency increases, but the change is not significant within 10 GHz. The corresponding part numbers are TP300, TP440, TP600, TP615, TP920, TP960, TP980, TP1020 etc.
2.Key Features
Ceramic-filled PTFE composite material
Dielectric constant: 6.15 ± 0.15 at 10 GHz/23°C
Dissipation factor: 0.002 at 10 GHz/23°C
Thermal decomposition temperature (Td) > 500°C
Thermal conductivity: 0.79 W/mK
Moisture absorption: 0.02%
CTE (-55 to 288°C): X/Y 17 ppm/°C, Z 24 ppm/°C
3.Benefits
Uniform mechanical properties across a range of Dk values, ideal for multi-layer and hybrid PCB designs
Low in-plane CTE matches copper, enhancing reliability for surface-mounted assemblies
Excellent dimensional stability, suitable for temperature-sensitive applications
Cost-effective due to volume manufacturing processes
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO3006 + Tg170 FR-4 |
| Layer Count | 3 layers |
| Board Dimensions | 98mm x 30mm (1PC) |
| Min. Trace/Space | 4/4 mils |
| Min. Hole Size | 0.3mm |
| Blind Vias | Top-Inn1, Inn1-Bot |
| Finished Thickness | 0.86mm |
| Cu Weight (Inner) | 0.5 oz (0.7 mils) |
| Cu Weight (Outer) | 1 oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | OSP |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Profile Feature | Staircase |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 - 35 μm
Rogers RO3006 - 10mil (0.254mm)
Copper layer 2 - 35 μm
Prepreg - 0.1mm
FR-4 Core Tg170 - 0.4mm
Copper_layer_3 - 35 μm
6.PCB Statistics:
Components: 12
Total Pads: 37
Thru Hole Pads: 21
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 39
Nets: 8
7.Typical Applications
Automotive radar, GPS antennas, cellular communication systems, patch antennas, direct broadcast satellites, datalink systems, remote meter readers, and power backplanes.
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support