F4BM220 2-Layer 0.5mm ENIG PCB for Microwave and Radar Systems
1.Introduction of F4BM220
Wangling's F4BM220 laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B220, mainly due to lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.
F4BM220 and F4BME220 have the same dielectric layer but different copper foil combinations: F4BM220 is paired with ED copper foil, suitable for applications without PIM requirements; F4BME220 is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.
By adjusting the ratio between polytetrafluoroethylene and fiberglass cloth, F4BM220 and F4BME220 achieve precise control of the dielectric constant, providing low loss and enhanced dimensional stability. A higher dielectric constant corresponds to a higher proportion of fiberglass, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss.
2.Key Features
Low Dielectric Constant: 2.2 ±0.04 at 10GHz
Ultra-Low Loss: Dissipation factor of 0.001 at 10GHz
Thermal Stability: CTE x-axis 25 ppm/°C, y-axis 34 ppm/°C, z-axis 240 ppm/°C (-55°C to 288°C)
Dielectric Stability: Thermal coefficient of Dk -142 ppm/°C (-55°C to 150°C)
Environmental Durability: Moisture absorption of ≤0.08%
Safety Certified: Flammability of UL-94 V0
3.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | F4BM220 |
| Layer Count | Double sided |
| Board Dimensions | 51mm × 67mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 5/8 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.6mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
4.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1 - 35 μm
F4BM220 Core - 0.5 mm
Copper Layer 2 - 35 μm
5.PCB Statistics:
Components: 5
Total Pads: 19
Thru Hole Pads: 11
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 17
Nets: 2
6.Typical Applications
Microwave, RF, and radar systems
Phase shifters
Power dividers, couplers, combiners
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications
Base station antennas
7.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
