F4BTM350 2-Layer 3.1mm Thick PCB for High-Frequency RF & Microwave Applications
1.Introduction of F4BTM350
Wangling's F4BTM350 laminates are engineered through a scientific formulation of fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene resin, followed by stringent pressing processes. This series builds upon the F4BM dielectric layer by incorporating high-dielectric, low-loss nano-ceramic materials. The result is a laminate with a higher dielectric constant, improved heat resistance, a lower thermal expansion coefficient, higher insulation resistance, and enhanced thermal conductivity—all while maintaining excellent low-loss characteristics.
F4BTM350 and F4BTME350 share the same dielectric layer but differ in copper foil type: F4BTM uses ED copper foil and is suitable for applications without PIM (Passive Intermodulation) requirements, while F4BTME uses reverse-treated (RTF) copper foil, offering superior PIM performance, more precise line control, and reduced conductor loss.
2.Key Features
Dielectric constant (Dk) of 3.5 ±0.07 at 10GHz
Dissipation factor of 0.0025 at 10GHz
CTE: x-axis 10 ppm/°C, y-axis 12 ppm/°C, z-axis 51 ppm/°C (-55°C to 288°C)
Low thermal coefficient of Dk: -60 ppm/°C (-55°C to 150°C)
Moisture absorption ≤ 0.05%
Flammability rating: UL-94 V0
CTI > 600V, Grade 0
3.Benefits of Using F4BTM350 in PCB Design
Excellent high-frequency performance with stable Dk and low loss
Enhanced thermal and mechanical reliability
Suitable for precision RF and microwave circuits
Compatible with immersion gold surface finish for improved solderability and shelf life
Supports fine trace/spacing down to 5/7 mils for high-density designs
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | F4BTM350 |
| Layer Count | 2-layer |
| Board Dimensions | 328mm x 84.08mm (±0.15mm) |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | No |
| Finished Board Thickness | 3.1mm |
| Finished Cu Weight (Outer) | 1oz (1.4 mils) |
| Via Plating Thickness | 20µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1: 35µm
F4BTM350 core: 3.048mm (120mil)
Copper layer 2: 35µm
6.PCB Statistics:
Components: 58
Total pads: 139
Through-hole pads: 97
Top SMT pads: 42
Bottom SMT pads: 0
Vias: 68
Nets: 2
7.Typical Applications
Microwave, RF, and radar systems
Phase shifters
Power dividers, couplers, combiners
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications
Base station antennas
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
