F4BTM300 2-Layer 10mil Ceramic-Filled PTFE PCB with ENIG Finish
1.Introduction
The F4BTM series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.
These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.
Furthermore, F4BTM laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.
2.Key Features
Dielectric constant (Dk) of 3 +/-0.06 at 10GHz
Dissipation factor of 0.0018 at 10GHz, 0.0023 at 20GHz
CTE x-axis of 15 ppm/°C, CTE y-axis of 16 ppm/°C, CTE z-axis of 72 ppm/°C, ranging -55°C to 288°C
Low thermal coefficient of Dk at -75 ppm/°C, ranging -55°C to 150°C
Moisture absorption of 0.05%
UL-94V0
3.Benefits
Enhanced dielectric constant and thermal performance with nano-ceramic fillers
Improved heat resistance and reduced thermal expansion
Higher insulation resistance and thermal conductivity
Low loss characteristics maintained
Excellent PIM performance with RTF copper foil
Precise line control and reduced conductor loss
4.PCB Details
| Specification | Value |
|---|---|
| Base Material | F4BTM300 |
| Layer Count | 2 layers |
| Board Dimensions | 112mm × 89mm (±0.15mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 μm
F4BTM300 Core – 0.254 mm (10mil)
Copper layer 2 – 35 μm
6.PCB Statistics
Components: 29
Total Pads: 106
Thru Hole Pads: 73
Top SMT Pads: 33
Bottom SMT Pads: 0
Vias: 26
Nets: 2
7.Typical Applications
Aerospace equipment, space and cabin equipment
Microwave, RF
Radar, military radar
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications, and more
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
