F4BTMS1000 PCB: High-Reliability Material for Aerospace Applications
1. Introduction to F4BTMS
The F4BTMS series represents an advanced iteration of the F4BTM series, featuring significant technological advancements in material formulation and manufacturing techniques. This series incorporates a higher concentration of ceramics and is reinforced with ultra-thin, ultra-fine glass fiber cloth, leading to enhanced material performance and a wider range of dielectric constants. Designed for high-reliability applications, it is particularly suitable for aerospace use and can effectively replace similar foreign materials.
Utilizing a blend of ultra-thin glass fiber cloth and a substantial amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin minimizes the adverse effects of glass fiber on electromagnetic wave propagation. This results in reduced dielectric loss, improved dimensional stability, and decreased X/Y/Z anisotropy. Additionally, the F4BTMS series expands the usable frequency range, enhances electrical strength, and improves thermal conductivity, all while exhibiting a low thermal expansion coefficient and stable dielectric temperature characteristics.
The F4BTMS series also comes standard with RTF low roughness copper foil, which diminishes conductor loss and provides exceptional peel strength. It is compatible with both copper and aluminum substrates.
2. Features of F4BTMS1000
Dielectric Constant (Dk): 10.2 at 10GHz
Dissipation Factor:0.0020 at 10GHz, 0.0023 at 20GHz
CTE (Coefficient of Thermal Expansion):
X-axis: 16 ppm/°C
Y-axis: 18 ppm/°C
Z-axis: 32 ppm/°C
Operating Range: -55°C to 288°C
Low Thermal Coefficient of Dk: -320 ppm/°C, -55°C to 150°C
High Thermal Conductivity: 0.81 W/mK
Low Moisture Absorption: 0.03%
3. PCB Stackup: 4-Layer Rigid PCB
| Specification | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| F4BTMS1000 Core | 6.35 mm (250 mil) |
| Copper Layer 2 | 35 µm |
| Prepreg RO4450F | 0.102 mm (4 mil) |
| Copper Layer 3 | 35 µm |
| F4BTMS1000 Core | 6.35 mm (250 mil) |
| Copper Layer 4 | 35 µm |
4. PCB Construction Details
Board Dimensions: 145 mm x 145 mm ± 0.15 mm
Minimum Trace/Space: 5/7 mils
Minimum Hole Size: 1.2 mm
No Blind Vias
Finished Board Thickness: 12.9 mm
Finished Cu Weight: Inner Layer/Outer Layer: 1 oz (1.4 mils)
Via Plating Thickness: 20 µm
Surface Finish: HASL
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical Testing: Conducted prior to shipment
5. PCB Statistics
Components: 19
Total Pads: 77
Thru Hole Pads: 35
Top SMT Pads: 42
Bottom SMT Pads: 0
Vias: 32
Nets: 2
6. Artwork Type Supplied:Gerber RS-274-X
8. Quality Standard:IPC-Class-2
9. Availability:Worldwide
10. Typical Applications
Aerospace equipment, including space and cabin systems
Microwave and RF applications
Radar and military radar technologies
Feed networks
Phase-sensitive antennas, including phased array systems
Satellite communications and more.