FR408HR High-Performance 4-Layer PCB Specifications for Enhanced Reliability
1.Essential Specifications for FR408HR PCB
| Specification | Details |
|---|---|
| Board Type | 4 Layers |
| Material Type | High-performance FR408HR |
| Solder Mask | Dual-sided, Blue |
| Silkscreen Print | Both sides in white |
| Surface Finish | ENIG |
| Total Board Thickness | 1.6mm +/- 10% |
| Dimensions | 140mm x 160mm (1 Piece) |
| Minimum Hole Size | 0.3mm |
| Solder Mask Thickness | 10µm |
| Minimum Dielectric Thickness | 100µm |
| Minimum Trace Width | 102µm |
| Minimum Spacing | 102µm |
| Blind Via | No |
| Buried Via | No |
| Filled and Capped Via | Yes |
2.PCB Stack-up Structure: 4-layer Rigid PCB (Component Side on Top)
| MATERIAL | COPPER LAYER | THICKNESS (µm) | SPECIFICATION |
|---|---|---|---|
| COPPER | 1 | 45 | 35µm base copper + 17µm plating |
| FR408HR | Prereg | 100 | IPC-4101/24 |
| COPPER | 2 | 35 | |
| FR408HR | Core | 1230 | IPC-4101/24 |
| COPPER | 3 | 35 | |
| FR408HR | Prepreg | 100 | IPC-4101/24 |
| COPPER | 4 | 45 | 35µm base copper + 17µm plating |
3.PCB Statistics:
Total Components: 92
Total Pads: 201
Through Hole Pads: 75
Top SMT Pads: 87
Bottom SMT Pads: 39
Vias: 72
Nets: 8
4.Additional Details
| Specification | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| F4BTMS1000 Core | 6.35 mm (250 mil) |
| Copper Layer 2 | 35 µm |
| Prepreg RO4450F | 0.102 mm (4 mil) |
| Copper Layer 3 | 35 µm |
| F4BTMS1000 Core | 6.35 mm (250 mil) |
| Copper Layer 4 | 35 µm |
5.Overview of FR408HR Laminates
The FR408HR laminate and prepreg materials are produced using Isola's cutting-edge multifaceted resin system, enhanced with electrical grade (E-glass) fabric. This innovative approach yields a 30% increase in Z-axis expansion and provides 25% greater electrical bandwidth (lower losses) compared to competing products in the market. These features, combined with exceptional moisture resistance at reflow, ensure a product that excels thermally and electrically.
Moreover, the FR408HR system exhibits laser fluorescence and UV blocking capabilities, maximizing compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems, and photo-imagable solder mask imaging solutions.
6.Key Features of FR408HR:
Glass Transition Temperature (Tg): 190°C by DSC
Dielectric Constant: 3.65 @ 10GHz
Dissipation Factor: 0.0095 @ 10GHz
RoHS Compliant: Yes
Compatible with FR-4 Processes: Yes
CAF Resistant: Yes
Lead-Free Assembly Compatibility: Yes
Pitch Capability: 0.8 mm
Reflow Capability: 6x 260°C
Solder Float Capability: 6x 288°C
Delamination Resistance (TMA): T260 > 60 minutes, T288 > 30 minutes
Flammability Rating for Laminate & Laminated Prepreg: UL-94 V0
7.Typical Applications of FR408HR PCBs:
High-Density Interconnect (HDI) PCBs
High-Speed Digital Circuits
Applications Requiring High Thermal Reliability
Networking and Communication Devices
Storage Solutions and Peripherals
Medical, Industrial, and Instrumentation Equipment
