High-Performance 2-Layer TLX-8 PCBs with ENEPIG Finish for Reliable RF Applications
1.Introduction to TLX-8 High Volume Antenna Material
TLX-8 is a PTFE fiberglass laminate designed for high-volume antenna applications, providing reliability across a wide range of RF uses. Its versatility comes from various available thicknesses and copper cladding options, making it suitable for low layer count microwave designs. TLX-8 offers mechanical reinforcement in harsh environments, such as:
Resistance to creep in PWBs subjected to high vibration during space launches
High temperature exposure in engine modules
Radiation resistance in space applications (see NASA’s guidelines for low outgassing materials)
Durability in extreme sea environments for naval antennas
Stability across a wide temperature range for altimeter substrates during flight
2. Key Features of TLX-8
Excellent PIM Values in PCBs (lower than -160 dBc)
Outstanding Mechanical and Thermal Properties
Low and Stable Dielectric Constant (Dk)
Dimensionally Stable
Low Moisture Absorption
Tightly Controlled Dk
Low Dissipation Factor (DF)
UL 94 V0 Flammability Rating
Ideal for Low Layer Count Microwave Designs
3. PCB Construction Details
| Specification | Details |
|---|---|
| Base Material | TLX-8 |
| Layer Count | 2 layers |
| Board Dimensions | 190mm x 150mm (39 types, 39 PCS, ± 0.15mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.25mm |
| Blind Vias | None |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1 oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Testing | 100% Electrical Testing conducted prior to shipment |
4. PCB Stackup
| Layer | Material | Thickness |
|---|---|---|
| Copper Layer 1 | Copper | 35 μm |
| Core | Taconic TLX-8 | 0.508 mm (20 mil) |
| Copper Layer 2 | Copper | 35 μm |
5.PCB Statistics
Components: 128
Total Pads: 187
Through Hole Pads: 31
Top SMT Pads: 156
Bottom SMT Pads: 0
Vias: 168
Nets: 2
6.Manufacturing & Compliance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping
7.Main Properties:
Electrical Properties:
Dielectric Constant @ 10 GHz: 2.55 ± 0.04
Dissipation Factor @ 10 GHz: 0.0018
Surface Resistivity (Elevated Temp): 6.605 x 10^8 Mohm
Surface Resistivity (Humidity Conditions): 3.550 x 10^6 Mohm
Volume Resistivity (Elevated Temp): 1.110 x 10^10 Mohm/cm
Volume Resistivity (Humidity Conditions): 1.046 x 10^10 Mohm/cm
Dimensional Stability:
MD After Bake: 0.06 mm/M
CD After Bake: 0.08 mm/M
MD Thermal Stress: 0.09 mm/M
CD Thermal Stress: 0.10 mm/M
CTE (25-260 °C):
X: 21 ppm/°C
Y: 23 ppm/°C
Z: 215 ppm/°C
Thermal Properties:
2% Weight Loss: 535 °C
5% Weight Loss: 553 °C
Chemical / Physical Properties:
Moisture Absorption: 0.02%
Dielectric Breakdown: > 45 kV
Flammability Rating: V-0 (UL-94)
8.Typical Applications
Radar Systems
Mobile Communications
Microwave Test Equipment
Microwave Transmission Devices
Couplers, Splitters, Combiners, Amplifiers, Antennas