RF-10 PCB 2-Layer 125mil High Dielectric Constant Laminates for Microstrip Patch Antennas1.Overview of RF-10 RF-10 copper clad laminates are advanced composites made from ceramic-filled PTFE and woven fiberglass. They offer high dielectric constant and low dissipation factor, making them suitable for high-frequency applications. The thin fiberglass reinforcement enhances both rigidity and dimensional stability, which is essential for multilayer circuit manufacturing. These laminates are designed to be a cost-effective substrate with reliable delivery times. RF-10 addresses the demand for size reduction in RF applications. It adheres well to smooth, low-profile copper, optimizing insertion losses at higher frequencies where skin effect losses become significant. 2.Key Features Dielectric Constant: 10.2 ± 0.3 at 10GHz 3.Advantages High dielectric constant for compact RF circuit design ![]() 4.PCB Stackup: 2-Layer Rigid PCB Copper Layer 1: 35 μm (1 oz) 5.PCB Construction Details
6. PCB Statistics Components: 12 7.Type of Artwork Supplied Gerber RS-274-X 8. Accepted Standard IPC-Class-2 9. Availability Worldwide 10. Typical Applications Microstrip Patch Antennas |