RO3006 High-Frequency PCB - 2-Layer 25mil Thick with ENIG Finish for RF/Microwave Applications
1.Introduction to RO3006 High-Frequency Laminate
Rogers RO3006 is a ceramic-filled PTFE composite designed for commercial microwave and RF applications. It provides exceptional dielectric constant (Dk) stability across temperatures, eliminating the Dk step change common in PTFE glass materials. Ideal for:
Automotive radar systems
5G wireless infrastructure
Satellite communications
2. Key Features
Dielectric Constant (Dk): 6.15 ± 0.15 @ 10 GHz/23°C
Dissipation Factor (Df): 0.002 @ 10 GHz
Thermal Stability: Td > 500°C
Thermal Conductivity: 0.79 W/mK
Moisture Absorption: 0.02%
CTE (Coefficient of Thermal Expansion):
X/Y-Axis: 17 ppm/°C (matches copper)
Z-Axis: 24 ppm/°C
3. Benefits
Stable Dk vs. Temperature/Frequency: Ensures reliable performance in RF circuits. Low CTE (Matches Copper): Reduces thermal stress for SMT assemblies. Cost-Effective Manufacturing: Suitable for high-volume production.
4. PCB Construction Details
| Specification | Details |
|---|---|
| Base Material | Rogers RO3006 high-frequency laminate |
| Layer Count | 2 layers |
| Board Dimensions | 76mm × 52mm (1 piece) |
| Trace/Space | 5/4 mils minimum |
| Minimum Hole Size | 0.35mm |
| Blind Vias | No |
| Finished Thickness | 0.71mm |
| Copper Weight | 1 oz (35µm) outer layers |
| Via Plating Thickness | 20µm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Solder Mask | Green (top), None (bottom) |
| Silkscreen | White (top), None (bottom) |
| Quality Assurance | 100% electrical testing before shipment |
5. PCB Stackup (2-Layer Rigid PCB)
Layer 1: Copper (35µm)
Substrate: Rogers RO3006 (25mil / 0.635mm)
Layer 2: Copper (35µm)
6.PCB Statistics
Components: 12
Total Pads: 32 (14 thru-hole, 18 top SMT)
Vias: 21
Nets: 2
7.Manufacturing & Compliance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping
8.Target Applications
Automotive: Radar, ADAS sensors
Telecom: 5G base stations, power amplifiers
Aerospace: GPS antennas, satellite communications
High-Speed Digital: Backplanes, datalinks