RO4350B PCB 2-Layer 13.3mil Low Loss Hydrocarbon/Ceramic Material for Multilayer Board Designs

1.Introduction of RO4350

Rogers RO4350B materials consist of proprietary woven glass-reinforced hydrocarbon and ceramics, offering electrical performance comparable to PTFE/woven glass while retaining the manufacturability of epoxy/glass. These laminates provide precise control over dielectric constant (Dk) and low loss, utilizing standard epoxy/glass processing methods. Available at a significantly lower cost than traditional microwave laminates, RO4350B does not require special through-hole treatments or handling procedures typical of PTFE-based materials. Additionally, these materials are UL 94 V-0 rated, making them suitable for active devices and high-power RF applications.

The thermal coefficient of expansion (CTE) of RO4350B materials presents several advantages for circuit designers. Its expansion coefficient is similar to that of copper, ensuring excellent dimensional stability, which is essential for mixed dielectric multi-layer board constructions. The low Z-axis CTE of RO4350B laminates guarantees reliable plated through-hole quality, even under severe thermal shock conditions. With a Tg exceeding 280°C (536°F), the expansion characteristics of RO4350B remain stable across the full range of circuit processing temperatures.

2. Features

- Dielectric Constant of DK 3.48 +/- 0.05 at 10 GHz/23°C  
- Dissipation Factor of 0.0037 at 10 GHz/23°C  
- Thermal Conductivity of 0.69 W/m·K  
- X-axis CTE of 10 ppm/°C, Y-axis CTE of 12 ppm/°C, Z-axis CTE of 32 ppm/°C  
- High Tg value of >280°C  
- Low moisture absorption of 0.06%  

3. Benefits
- Suitable for multi-layer board (MLB) constructions  
- Processes similarly to FR-4 at a reduced fabrication cost  
- Excellent dimensional stability  
- Competitively priced  

4.PCB Stackup: 2-layer rigid PCB
Copper layer1 :35 µm  
Rogers RO4350B Core : 0.338 mm (13.3 mil)  
Copper layer2 :35 µm  

5.PCB Construction Detail

- Board dimensions: 40 mm x 40 mm = 1 PCS, +/- 0.15 mm  
- Minimum Trace/Space: 5/6 mils  
- Minimum Hole Size: 0.2 mm  
- No blind vias  
- Finished board thickness: 0.5 mm  
- Finished Cu weight: 1 oz (1.4 mils) for outer layers  
- Via plating thickness: 20 µm  
- Surface finish: Immersion Gold  
- Top Silkscreen: White  
- Bottom Silkscreen: No  
- Top Solder Mask: No  
- Bottom Solder Mask: No  
- 100% electrical testing conducted prior to shipment  

 6.PCB Statistics
- Components: 10  
- Total Pads: 29  
- Through Hole Pads: 19  
- Top SMT Pads: 10  
- Bottom SMT Pads: 0  
- Vias: 21  
- Nets: 1  

 7.Type of Artwork Supplie:
Gerber RS-274-X

8.Quality Standard:
IPC-Class-2

9. Availability: Worldwide

10. Some Typical Applications

- Cellular base station antennas and power amplifiers  
- RF identification tags  
- Automotive radar and sensors  
- LNBs for direct broadcast satellites