RO4535 PCB 2-Layer 20mil High-Frequency Laminates for Antenna and Mobile Infrastructure Applications

1.Introduction of RO453

RO4535 High Frequency Laminates are cost-effective performance materials developed by Rogers Corporation to address the specific needs of the antenna market.

These laminates expand on the capabilities of the successful RO4000 series, offering a ceramic-filled, glass-reinforced hydrocarbon material that ensures a controlled dielectric constant, low loss performance, and excellent passive intermodulation response, making them ideal for mobile infrastructure microstrip antenna applications.

RO4535 laminates are fully compatible with standard FR-4 and high-temperature lead-free solder processing. Unlike traditional PTFE-based laminates, they do not require special treatments for plated through-hole preparation. This product presents an affordable alternative to conventional PTFE antenna technologies, enabling designers to optimize both cost and performance for their antennas. Additionally, RO4535 laminates are available with Rogers' RoHS-compliant flame-retardant technology for applications that necessitate UL94 V-0 certification.

2.Feature

- Dielectric Constant of DK 3.44 +/-0.08 at 10 GHz/23°C  
- Dissipation Factor of 0.0037 at 10 GHz/23°C  
- Thermal Conductivity of 0.6 W/m·K  
- X-axis CTE of 16 ppm/°C, Y-axis CTE of 17 ppm/°C, Z-axis CTE of 50 ppm/°C  
- High Tg value of >280 °C  
- Low moisture absorption of 0.09%  
- UL-94 V0 rated  

3. Benefits
- Exceptional passive intermodulation (PIM) performance with LoPro copper foil  
- Enhanced mechanical rigidity compared to PTFE  
- CTE similar to that of copper, minimizing stress in PCB antennas  

4.PCB Stackup: 2-layer rigid PCB
Copper layer1 :35 µm  
Rogers RO4350B Core : 0.508mm (20 mil)  
Copper layer2 :35 µm  

5.PCB Construction Detail

- Board dimensions: 53 mm x 53 mm = 1 PCS, +/- 0.15 mm  
- Minimum Trace/Space: 4/4 mils  
- Minimum Hole Size: 0.3 mm  
- No blind vias.  
- Finished board thickness: 0.6 mm  
- Finished copper weight: 1 oz (1.4 mils) on outer layers  
- Via plating thickness: 20 µm  
- Surface finish: Immersion Gold  
- Top Silkscreen: White  
- Bottom Silkscreen: None  
- Top Solder Mask: Green  
- Bottom Solder Mask: Green  
- 100% electrical testing conducted prior to shipment

 6.PCB Statistics
- Components: 11  
- Total Pads: 22  
- Through Hole Pads: 12  
- Top SMT Pads: 10  
- Bottom SMT Pads: 0  
- Vias: 17  
- Nets: 2  

 7.Type of Artwork Supplie:
Gerber RS-274-X

8.Quality Standard:
IPC-Class-2

9. Availability: Worldwide

10. Some Typical Applications

- Antennas for cellular infrastructure base stations