Rogers TMM13i 2-Layer 3.9mm OSP PCB for Chip Tester & Satellite Communication

1.Introduction to TMM13i PCB

The Rogers TMM13i isotropic thermoset microwave material is a ceramic thermoset polymer composite tailored for high reliability in plated thru-hole strip-line and micro-strip applications. It features an isotropic dielectric constant (Dk) and integrates the advantageous properties of both ceramic and PTFE substrates, while allowing for the convenience of soft substrate processing methods.

This 2-layer rigid PCB is constructed entirely with TMM13i as the core material, providing excellent signal integrity, thermal stability, and high-dielectric-constant performance for demanding RF and microwave applications.

2.Key Features of TMM13i

• Dielectric Constant Dk of 12.85 ± 0.35

• Dissipation factor of 0.0019 at 10GHz

• Thermal coefficient of Dk of -70 ppm/°K

• Copper matched Coefficient of Thermal Expansion (-55 to 288°C): X axis 19 ppm/°C, Y axis 19 ppm/°C, Z direction 20 ppm/°C

• Lead free Process Compatible, 94V-0 flammability

3. Benefits of TMM13i PCB

• Mechanical properties resist creep and cold flow

• Resistant to process chemicals, reducing damage during fabrication

• Material does not require a sodium napthanate treatment prior to electroless plating

• Based on a thermoset resin, allowing for reliable wire-bonding

4.TMM13i PCB Construction Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 – 35 μm
TMM13i – 3.81 mm (150 mil)
Copper_layer_2 – 35 μm

6.PCB Statistics

Components: 29
Total Pads: 47
Thru Hole Pads: 19
Top SMT Pads: 28
Bottom SMT Pads: 0
Vias: 26
Nets: 2

7.Primary Application Areas

• Chip testers

• Dielectric polarizers, lenses

• Filters, couplers

• RF and microwave circuitry

• Satellite communication systems

8.Quality Assurance

Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide

9.TMM® Thermoset Microwave Materials – TMM13i High Frequency Materials

TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings.

The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. TMM laminates do not require a sodium napthanate treatment prior to electroless plating.

TMM laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material's isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.

TMM laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.

TMM laminates combine many of the desirable features of ceramic substrates with the ease of soft substrate processing techniques. TMM laminates are available clad with 1/2 oz/ft² to 2 oz/ft² electrodeposited copper foil, or bonded directly to brass or aluminum plates. Substrate thicknesses of 0.015" to 0.500" are available. The base substrate is resistant to etchants and solvents used in printed circuit production. Consequently, all common PWB processes can be used to produce TMM thermoset microwave materials.

The Rogers TMM13i isotropic thermoset microwave material is a ceramic thermoset polymer composite tailored for high reliability in plated thru-hole strip-line and micro-strip applications. It features an isotropic dielectric constant (Dk) and integrates the advantageous properties of both ceramic and PTFE substrates, while allowing for the convenience of soft substrate processing methods.

10.Features and Benefits

• Wide range of dielectric constants

• Exceptional mechanical properties

• Coefficient of thermal expansion matched to copper

• Resistant to process chemicals

• Thermoset resin

• Ideal for single material systems on a wide variety of applications

• Resist creep and cold flow

• High reliability of plated through holes

• Reduces damage to material during fabrication and assembly processes

• Reliable wirebonding

• No specialized production techniques required

• TMM10 and 10i laminates can replace alumina substrates

11.TMM13i Data Sheet

12.Some Typical Applications

• RF and microwave circuitry

• Power amplifiers and combiners

• Filters and couplers

• Satellite communication systems

• Global Positioning Systems Antennas

• Patch Antennas

• Dielectric polarizers and lenses

• Chip testers

13.Standard Thicknesses, Panel Sizes & Claddings

Standard Panel Sizes

• 18" × 12" (457 mm × 305 mm)

• 18" × 24" (457 mm × 610 mm)

• *Additional panel sizes available

Standard Claddings (Electrodeposited Copper Foil)

• ½ oz. (18 µm) HH/HH

• 1 oz. (35 µm) H1/H1

• *Additional claddings such as heavy metal and unclad are available