TP1020 2-Layer 4.1mm Thick ENIG PCB for High-Frequency RF/Microwave Applications
1.Introduction
TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. TP refers to the smooth surface material without copper cladding, TP-1 refers to the material with copper cladding on one side, and TP-2 refers to the material with copper cladding on both sides.
The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20. The dielectric loss is low, and the loss increases as the frequency increases, but the change is not significant within 10 GHz. The corresponding part numbers are TP300, TP440, TP600, TP615, TP920, TP960, TP980, TP1020 etc.
2.Key Features
Dielectric constant (Dk) of 10.2±0.2 at 10GHz
Dissipation factor of 0.0012 at 10GHz
Low TCDK at -40 ppm/°C, -55°C to 150°C
CTE x-axis of 40 ppm/°C, CTE y-axis of 40 ppm/°C, CTE z-axis of 55 ppm/°C, -55°C to 150°C
Thermal conductivity of 0.67 W/mk
Moisture absorption of 0.01%
UL 94-V0
3.Benefits
Adjustable dielectric constant (3-25 range)
Excellent dielectric performance and high reliability
No fiberglass reinforcement
Stable electrical properties
Low dielectric loss
Special production process ensures quality
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | TP1020 |
| Layer Count | Double sided (2-layer) |
| Board Dimensions | 31mm x 31mm (±0.15mm) |
| Minimum Trace/Space | 7/9 mils |
| Minimum Hole Size | 0.6mm |
| Blind Vias | No |
| Finished Thickness | 4.1mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 - 35 μm
TP1020 Core - 4.0 mm (157.5mil)
Copper layer 2 - 35 μm
6.PCB Statistics:
Components: 2
Total Pads: 12
Thru Hole Pads: 8
Top SMT Pads: 4
Bottom SMT Pads: 0B
Vias: 8
Nets: 2
7.Typical Applications
Global Satellite Navigation System
Missile-borne systems
Fuze technology
Miniaturized antenna
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support