Taconic RF-30A 2-Layer 0.6mm ENIG PCB – RF/Microwave Communication
1.Introduction to RF-30A PCB
RF-30A is a high-performance RF-grade laminate material engineered with advanced resin system and optimized glass fabric reinforcement, delivering exceptional high-frequency signal transmission performance, low dielectric loss and outstanding environmental stability. It is specifically designed for high-speed, high-frequency RF applications and can fully comply with 260℃ lead-free assembly processes, ensuring reliable performance in harsh operating conditions.
This 2-layer rigid PCB is constructed entirely with RF-30A as the core material, providing excellent signal integrity and thermal reliability for demanding RF and microwave circuits.
2.Key Features of RF-30A
Dielectric Constant (DK): 3.0 at 10GHz Dissipation Factor (Df): 0.003 at 10GHz Thermal resistance: T260 >90 minutes, T288 >30 minutes Peel strength (Min.): 9 lbs/inch for standard ED copper CTE matched to copper: X axis 9-11 ppm/°C, Y axis 11-13 ppm/°C Low Z-axis CTE: 38 ppm/°C Tg: >180°C Ultra-low moisture absorption: 0.08% UL 94-V0 flammability rating Excellent CAF resistance and chemical resistance High thermal conductivity for efficient heat dissipation
3.Benefits of RF-30A PCB
Exceptional high-frequency signal transmission performance Low dielectric loss for improved signal integrity Outstanding environmental stability 260°C lead-free process compatible Reliable performance in harsh operating conditions CTE matched to copper for excellent plated-through hole reliability Low moisture absorption ensures consistent electrical performance Excellent CAF and chemical resistance for long-term reliability
4.RF-30A PCB Construction Details
| Item | Specification |
|---|
| Base material | RF-30A |
| Layer count | 2 layers |
| Board dimensions | 85.6mm x 99.8mm = 1PCS |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.25mm |
| Blind vias | No |
| Finished board thickness | 0.6mm |
| Finished Cu weight | 1 oz (1.4 mils) outer layers |
| Via plating thickness | 20 μm |
| Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| 100% Electrical test | Used prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 35 μm
RF-30A 20 mil (0.508 mm)
Copper_layer_2 35 μm
6.PCB Statistics
Components: 54
Total Pads: 43
Thru Hole Pads: 19
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 36
Nets: 2
7.Primary Application Areas
RF/Microwave Communication Devices 5G/6G Base Stations & Antennas Radar Systems Satellite Communication Equipment RF Modules & Transceivers Aerospace & Defense Electronics High-Frequency Test Instruments Automotive RF Components (V2X, Radar)
8.Quality Assurance
Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide
9.RF-30A High-Frequency Laminate – Product Introduction
RF-30A is a high-performance RF-grade laminate material engineered with an advanced resin system and optimized glass fabric reinforcement, delivering exceptional high-frequency signal transmission performance, low dielectric loss, and outstanding environmental stability. It is specifically designed for high-speed, high-frequency RF applications and can fully comply with 260℃ lead-free assembly processes, ensuring reliable performance in harsh operating conditions.
The material combines excellent electrical properties with robust mechanical characteristics, making it an ideal choice for demanding RF and microwave circuits where signal integrity and thermal reliability are critical.
10.Features and Benefits
| Feature | Value |
|---|
| Dielectric Constant (Dk) | 3.0 @ 10GHz |
| Dissipation Factor (Df) | 0.003 @ 10GHz |
| Thermal Resistance (T260) | >90 minutes |
| Thermal Resistance (T288) | >30 minutes |
| Peel Strength (Min.) | 9 lbs/inch (ED copper) |
| CTE - X axis | 9-11 ppm/°C |
| CTE - Y axis | 11-13 ppm/°C |
| CTE - Z axis | 38 ppm/°C |
| Tg | >180°C |
| Moisture Absorption | 0.08% (ultra-low) |
| Flammability Rating | UL 94-V0 |
| CAF Resistance | Excellent |
| Chemical Resistance | Excellent |
| Thermal Conductivity | High |
Benefits
Exceptional high-frequency signal transmission performance Low dielectric loss for improved signal integrity Outstanding environmental stability 260°C lead-free process compatible Reliable performance in harsh operating conditions CTE matched to copper for excellent plated-through hole reliability Low moisture absorption ensures consistent electrical performance Excellent CAF and chemical resistance for long-term reliability High thermal conductivity for efficient heat dissipation
11.RF-30A Data Sheet
| Property | Typical Value | Direction | Units | Conditions |
|---|
| Dielectric Constant (Dk) | 3.0 | Z | – | 10 GHz |
| Dissipation Factor (Df) | 0.003 | Z | – | 10 GHz |
| Thermal Resistance (T260) | >90 | – | minutes | – |
| Thermal Resistance (T288) | >30 | – | minutes | – |
| Peel Strength (Min.) | 9 | – | lbs/inch | Standard ED copper |
| CTE - X axis | 9-11 | X | ppm/°C | – |
| CTE - Y axis | 11-13 | Y | ppm/°C | – |
| CTE - Z axis | 38 | Z | ppm/°C | – |
| Glass Transition Temperature (Tg) | >180 | – | °C | – |
| Moisture Absorption | 0.08 | – | % | Ultra-low |
| Flammability Rating | UL 94-V0 | – | Class | – |
| CAF Resistance | Excellent | – | – | – |
| Chemical Resistance | Excellent | – | – | – |
| Thermal Conductivity | High | Z | W/m·K | – |
12.Some Typical Applications
RF/Microwave Communication Devices 5G/6G Base Stations & Antennas Radar Systems Satellite Communication Equipment RF Modules & Transceivers Aerospace & Defense Electronics High-Frequency Test Instruments Automotive RF Components (V2X, Radar)
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