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Wangling WL-CT330 4-Layer 2.7mm Immersion Gold PCB – 5G, Radar & Satellite
1.Introduction to WL-CT330 PCB
WL-CT330 is a thermosetting high-frequency laminate composed of hydrocarbon resin, composite ceramics, and fiberglass reinforcement. It offers stable dielectric properties, ultra-low loss, and a high Tg (>280℃) for thermal reliability; processes like FR4 (simpler than PTFE), supports lead-free assembly (260℃), and is a cost-effective alternative to traditional high-frequency materials for high-speed RF designs.
This 4-layer rigid PCB combines WL-CT330 with High Tg FR-4 (S1000-2M) to achieve excellent mechanical stability, thermal reliability, and high-frequency signal integrity, making it ideal for demanding RF and microwave applications.
2.Key Features of WL-CT330
Dielectric Constant (DK): 3.30 ± 0.06 at 10GHz Dissipation Factor (Df): 0.0026 at 10GHz Tg: >280℃ Thermal Conductivity: 0.59 W/m·K Thermal Resistance: T260 >60 mins, T288 >20 mins (typical for series) Peel Strength (Min.): 0.85 N/mm (≈9.7 lbs/inch) for 1OZ ED Copper CTE: X = 15 ppm/℃, Y = 13 ppm/℃, Z = 39 ppm/℃ Moisture Absorption: 0.05% (max.) UL 94-V0 flammability rating High volume/surface resistivity (5×10⁹ Mohm·cm / Mohm) Stable TcDk (temperature coefficient of DK)
3.Benefits of WL-CT330 PCB
Stable dielectric properties over frequency and temperature Ultra-low loss for high-speed and high-frequency designs High Tg (>280°C) ensures thermal reliability during lead-free assembly Processable like standard FR4 – no special PTFE-specific handling required Excellent dimensional stability with CTE matched to copper High thermal conductivity for power applications Cost-effective alternative to traditional high-frequency laminates Reliable plated-through hole performance
4.WL-CT330 PCB Construction Details
| Item | Specification |
|---|
| Base material | WL-CT330 + High Tg FR-4 (S1000-2M) |
| Layer count | 4-layer |
| Board dimensions | 165mm x 96.5mm = 1PCS, +/- 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.25mm |
| Blind vias | No |
| Finished board thickness | 2.7mm |
| Finished Cu weight | 1oz (1.4 mils) inner/outer layers |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Gold |
| Top Silkscreen | Black |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| 100% Electrical test | Used prior to shipment |
5.PCB Stackup (4-Layer Rigid Structure)
Copper_layer_1 35 μm
WL-CT330 1.524 mm (60 mil)
Copper_layer_2 35 μm
Prepreg 1080 RC63% + 7628 (43%) 0.254 mm (10 mil)
Copper_layer_3 35 μm
S1000-2M 0.8 mm (31.5 mil)
Copper_layer_4 35 μm
6.PCB Statistics
Components: 45
Total Pads: 225
Thru Hole Pads: 126
Top SMT Pads: 59
Bottom SMT Pads: 40
Vias: 63
Nets: 9
7.Primary Application Areas
5G/6G base stations & phased array antennas Automotive radar (ADAS, V2X) Satellite communication & navigation Aerospace/defense radar (early warning, airborne) RF power amplifiers & transceivers High-speed backplanes & server/networking gear
8.Quality Assurance
Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide
9.WL-CT330 High-Frequency Laminate – Product Introduction
WL-CT330 is a thermosetting high-frequency laminate composed of hydrocarbon resin, composite ceramics, and fiberglass reinforcement. It offers stable dielectric properties, ultra-low loss, and a high Tg (>280℃) for thermal reliability; processes like FR4 (simpler than PTFE), supports lead-free assembly (260℃), and is a cost-effective alternative to traditional high-frequency materials for high-speed RF designs.
The WL-CT series (including WL-CT330) uses hydrocarbon resin and ceramic-filled fiberglass reinforcement, providing low-loss performance while maintaining FR4-like processability – much simpler than PTFE-based materials, ensuring better circuit consistency and stability. These materials can replace similar foreign products.
Available dielectric constants in the WL-CT series: 3.00, 3.30, 3.38, 3.48, 4.10, 6.15.
The series is available with ED copper or reverse-treated (RTF) copper foil. RTF copper foil offers excellent PIM performance, reduces conductor loss and insertion loss, and uses an adhesive treatment for better bonding.
Aluminum-backed versions (WL-CT***-AL) are also available for shielding or heat dissipation.
10.Features and Benefits
Key Features
Low dielectric constant tolerance and low loss Hydrocarbon ceramic thermoset resin system – better PCB processability and heat resistance Excellent dielectric constant temperature stability CTE in X/Y direction matched to copper; low Z-axis CTE for thermal stability and plated-through hole reliability High Tg >280°C – maintains dimensional stability and copper hole quality at high temperatures High thermal conductivity – better than comparable thermoplastic materials, suitable for high-power applications Commercial, high-volume, cost-effective product Excellent radiation resistance – maintains dielectric and physical properties after irradiation Low outgassing – meets aerospace vacuum outgassing requirements
11.WL-CT330 Data Sheet
| Property | Test Condition | Units | WL-CT330 Typical Value |
|---|
| Dielectric Constant (typical) | 10 GHz | – | 3.30 |
| Dielectric Constant (design) | 10 GHz | – | 3.45 |
| Dielectric Constant Tolerance | – | – | ±0.06 |
| Dissipation Factor (typical) | 2 GHz | – | 0.0021 |
| Dissipation Factor (typical) | 10 GHz | – | 0.0026 |
| Dissipation Factor (typical) | 20 GHz | – | 0.0033 |
| Temperature Coefficient of Dk | -55°C to +150°C | ppm/°C | 43 |
| Peel Strength (1 oz RTF copper) | – | N/mm | 1.0 |
| Peel Strength (1 oz ED copper) | – | N/mm | 0.72 |
| Volume Resistivity | Normal state | Mohm·cm | 5×10⁹ |
| Surface Resistivity | Normal state | Mohm | 5×10⁹ |
| Electrical Strength (Z direction) | 5kV, 500V/s | kV/mm | 22 |
| Breakdown Voltage (XY direction) | 5kV, 500V/s | kV | 22 |
| CTE (X direction) | -55°C to 288°C | ppm/°C | 15 |
| CTE (Y direction) | -55°C to 288°C | ppm/°C | 13 |
| CTE (Z direction) | -55°C to 288°C | ppm/°C | 39 |
| Thermal Stress | 288°C, 10s, 3 times | – | No delamination |
| Moisture Absorption | 20±2°C, 24 hours | % | 0.02 |
| Density | Room temperature | g/cm³ | 1.82 |
| Long-Term Operating Temperature | – | °C | -55 to +260 |
| Thermal Conductivity (Z direction) | – | W/(m·K) | 0.59 |
| PIM Value (with RTF copper) | – | dBc | ≤ -157 |
| Flammability Rating | UL-94 | Class | Non-flame retardant |
| Tg | – | °C | >280 |
| Td (onset) | – | °C | 421 |
| Halogen Content | – | – | Halogen-free / Halogen (options) |
| Material Composition | – | – | Hydrocarbon + Ceramic + Fiberglass |
12.Some Typical Applications
Aerospace equipment, space and airborne systems, aircraft Microwave, antenna, phase-sensitive antennas Early warning radar, airborne radar, and other radar systems Phased array antennas, beamforming networks Satellite communication and navigation Power amplifiers
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