Taconic TLX-0 2-Layer 20mil Low-Dk PTFE PCB with HASL Finish
1.Introduction of Core
TLX series laminates are made using PTFE fiberglass composites, offering reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.
TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as:
Resistance to creep for PCBs bolted to a housing that encounters high levels of vibration during space launch
High temperature exposure in engine modules
Radiation resistance in space (see NASA's website for low outgassing materials)
Resistance to extreme environments at sea for warship antennas
Resistance to a wide temperature range for altimeter substrates during flight
TLX-0 is one the series materials with dielectric constant of 2.45 with tight tolerance of ± 0.04.
2.Key Features
Dielectric Constant of DK 2.45 +/-0.04 at 10GHz
Dissipation Factor of 0.0021 at 10GHz
Low moisture absorption of 0.02%
X axis CTE of 21 ppm/°C, Y CTE of 23 ppm/°C, Z CTE of 215ppm/°C
Strong Peel strength of 12 lbs/in
3.Benefits
Excellent PIM Values in PCBs (measured at lower than -160 dBc)
Excellent Mechanical & Thermal Properties
Low and Stable Dk for consistent circuit performance
Dimensionally Stable for reliable fabrication
Low Moisture Absorption for environmental stability
Tightly Controlled DK (±0.04)
Low DF (0.0021) for minimal signal loss
UL 94 V0 Rating for flame retardancy
Ideal for Low Layer Count Microwave Designs
Proven performance in extreme environments: space, high temperature, radiation, marine, and wide temperature ranges
4.PCB Construction Details
| Specification |
Value |
| Base Material | TLX-0 |
| Layer Count | 2-layer |
| Board Dimensions | 89mm × 46mm (±0.15mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.6mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | HASL |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 μm
TLX-0 Core – 0.508 mm (20mil)
Copper layer 2 – 35 μm
6.PCB Statistics:
Components: 21
Total Pads: 58
Thru Hole Pads: 32
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 67
Nets: 2
7.Typical Applications
Couplers, splitters, combiners, amplifiers, antennas and passive components
Radar systems, mobile communications
Microwave test equipment
Microwave transmission devices and RF components
8.Quality Assurance
Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide
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