Home > Newly Shipped PCB > Taconic TLX-9 2-Layer 0.3mm EPIG (Nickel-Free) PCB – Low Dk RF Applications

TLX-9 PCB 10mil EPIG (Nickle-free)
PCB Material:Taconic TLX-9 (PTFE/Woven Glass) / 0.3mm
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

Taconic TLX-9 2-Layer 0.3mm EPIG (Nickel-Free) PCB – Low Dk RF Applications


1. Introduction to Taconic TLX-9 PCB

TLX-9 is a composite of PTFE/woven glass laminates with exceptionally well controlled electrical and mechanical properties. TLX-9 laminates can be sheared, drilled, milled and plated using standard methods for PTFE/woven fiberglass materials. The laminates are dimensionally stable, and exhibit virtually no moisture absorption during fabrication processes.


TLX-9 measured 2.5 Dk with tightly controlled across a broad frequency range and temperature spectrum. The dissipation factor is approximately 0.0019 when measured at 10 GHz. TLX-9 meets stringent flammability standards, achieving a UL 94 V-0 certification for flame retardancy.


This 2-layer rigid PCB is constructed entirely with Taconic TLX-9 as the core material, making it ideal for LNAs, LNBs, LNCs, PCS/PCN large format antennas, high power amplifiers, and passive components.


TLX-9 PCB 10mil EPIG (Nickle-free)


2. Key Features of Taconic TLX-9 PCB

Dielectric constant of 2.5 at 10 GHz

Dissipation factor of 0.0019 at 10 GHz

Moisture absorption of <0.02%

Dielectric breakdown of >60 kV

Volume resistivity of 10⁷ Mohm/cm

Surface resistivity of 10⁷ Mohm

Arc resistance of >180 seconds

Flexural strength lengthwise: >23,000 lbs/in (>159 N/mm²)

Flexural strength crosswise: >19,000 lbs/in (>131 N/mm²)

Peel strength (1 oz copper): 12 lbs/linear in (2.1 N/mm)

Thermal conductivity of 0.19 W/(m·K)

x-y CTE: 9-12 ppm/°C

z CTE: 130-145 ppm/°C

UL 94 V-0 flammability rating


3. Benefits of Taconic TLX-9 PCB

Low dielectric constant

Low dissipation factor

Low moisture absorption

High dielectric breakdown

Good peel strength

Controlled coefficient of thermal expansion (CTE)

Dimensionally stable

Exceptionally well controlled electrical and mechanical properties


4.Taconic TLX-9 PCB Construction Details

ItemSpecification
Base materialTaconic TLX-9
Layer count2 layers
Board dimensions91.6mm x 45.3mm = 1 PCS, +/- 0.15mm
Minimum Trace/Space5/6 mils
Minimum Hole Size0.3mm
Blind viasNo
Finished board thickness0.3mm
Finished Cu weight1 oz (1.4 mils) outer layers
Via plating thickness20 μm
Surface finishEPIG (Nickel-Free)
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
100% Electrical testUsed prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm (1 oz)

Taconic TLX-9 Core - 0.254 mm (10 mil)

Copper_layer_2 - 35 μm (1 oz)


6. PCB Statistics

Components: 29

Total Pads: 45

Thru Hole Pads: 24

Top SMT Pads: 21

Bottom SMT Pads: 0

Vias: 19

Nets: 2


7. Primary Application Areas

LNAs, LNBs, and LNCs

PCS/PCN large format antennas

High power amplifiers

Passive components

Radar systems

Phased array antennas

Mobile communication systems

Microwave test equipment

Microwave transmission devices

RF components


8.Quality Assurance

Type of artwork supplied: Gerber RS-274-X

Accepted standard: IPC-Class-3

Availability: Worldwide


9. Taconic TLX-9 PTFE/Woven Glass Laminate – Product Introduction

Taconic has over 35 years of experience coating fiberglass fabric with PTFE (polytetrafluoroethylene). This enables Taconic to manufacture copper clad PTFE/woven glass laminates with exceptionally well controlled electrical and mechanical properties.


The dielectric constant (Dk) range is 2.45 to 2.65. The Dk can be specified anywhere within this range with a tolerance of ±0.04. The dissipation factor is approximately 0.0019 when measured at 10 GHz.


TLX laminates can be sheared, drilled, milled and plated using standard methods for PTFE/woven fiberglass materials. The laminates are dimensionally stable, and exhibit virtually no moisture absorption during fabrication processes.


TLX laminates are generally ordered clad on one or both sides with 1/2, 1, or 2 oz. electrodeposited copper. Contact customer service for alternate claddings.


TLX laminates are tested in accordance with IPC-TM 650. A Certificate of Compliance containing actual test data accompanies each shipment.


CCL 27 TLX-9


10. Features and Benefits Summary

FeatureBenefit
Dk of 2.5 at 10 GHzLow dielectric constant for high frequency performance
Df of 0.0019 at 10 GHzLow dissipation factor for minimal signal loss
Moisture absorption <0.02%Virtually no moisture absorption during fabrication
Dielectric breakdown >60 kVHigh electrical strength for reliability
Volume/surface resistivity of 10⁷Excellent insulation properties
Arc resistance >180 secondsHigh resistance to arcing
Flexural strength >23,000 lbs/in (lengthwise)Excellent mechanical robustness
Peel strength of 12 lbs/linear in (1 oz Cu)Good copper adhesion
Thermal conductivity of 0.19 W/(m·K)Adequate heat dissipation
x-y CTE of 9-12 ppm/°CExcellent dimensional stability
UL 94 V-0 ratingFlame retardant for safety

11.Taconic TLX-9 Data Sheet

PropertyTest MethodUnitsValue
Dielectric Constant @ 10 GHzIPC-TM 650 2.5.5.5-2.50
Dissipation Factor @ 10 GHzIPC-TM 650 2.5.5.5-0.0019
Moisture AbsorptionIPC-TM 650 2.6.2.1%<0.02
Dielectric BreakdownIPC-TM 650 2.5.6kV>60
Volume ResistivityIPC-TM 650 2.5.17.1Mohm/cm10⁷
Surface ResistivityIPC-TM 650 2.5.17.1Mohm10⁷
Arc ResistanceIPC-TM 650 2.5.1seconds>180
Flexural Strength LengthwiseIPC-TM 650 2.4.4lbs/in (N/mm²)>23,000 (>159)
Flexural Strength CrosswiseIPC-TM 650 2.4.4lbs/in (N/mm²)>19,000 (>131)
Peel Strength (1 oz copper)IPC-TM 650 2.4.8lbs/linear in (N/mm)12.0 (2.1)
Thermal ConductivityASTM F 433W/(m·K)0.19
x-y CTEASTM D3386 (TMA)ppm/°C9-12
z CTEASTM D3386 (TMA)ppm/°C130-145
UL-94 Flammability RatingUL 94-V-0

12. Some Typical Applications

LNAs, LNBs, and LNCs

PCS/PCN large format antennas

High power amplifiers

Passive components

Radar systems

Phased array antennas

Mobile communication systems

Microwave test equipment

Microwave transmission devices

RF components


13. Standard Thicknesses, Panel Sizes & Claddings

TLX-9 Dielectric Thickness Options

Dielectric Thickness (inches)Dielectric Thickness (mm)
0.0050" - 0.0190"0.13mm - 0.48mm
0.0200" - 0.0300"0.50mm - 0.76mm
≥ 0.0310"≥ 0.78mm

Standard Panel Sizes

Inchesmm
12" x 18"304mm x 457mm
16" x 18"406mm x 457mm
18" x 24"457mm x 610mm
16" x 36"406mm x 914mm
24" x 36"610mm x 914mm
18" x 48"457mm x 1220mm

Standard Electrodeposited Copper Claddings

DesignationWeightCopper Thickness
CH1/2 oz/sq. ft.~0.0007" (~18 μm)
C11 oz/sq. ft.~0.0014" (~35 μm)
C22 oz/sq. ft.~0.0028" (~70 μm)

 

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