Home > Newly Shipped PCB > Rogers RT/duroid 6006 2-Layer 0.4mm Immersion Silver PCB – High Dk Microwave Applications

RTduroid 6006 PCB 10mil Immersion Silver
PCB Material:Rogers RT/duroid 6006 (Ceramic-PTFE) / 0.4mm
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

Rogers RT/duroid 6006 2-Layer 0.4mm Immersion Silver PCB – High Dk Microwave Applications


1. Introduction to Rogers RT/duroid 6006 PCB

Rogers RT/duroid 6006 laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. They provide high dielectric constants (Dk) to enable circuit size reduction. These materials are low loss, ideal for operating at X-band or below. Additionally, their tight Dk and thickness control deliver repeatable circuit performance.


RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. They have tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.


This 2-layer rigid PCB is constructed entirely with Rogers RT/duroid 6006 as the core material, making it ideal for patch antennas, satellite communications systems, power amplifiers, and ground radar warning systems.


RTduroid 6006 PCB 10mil Immersion Silver


2. Key Features of Rogers RT/duroid 6006 PCB

Rogers RT/duroid 6006 ceramic-PTFE composites

Dk of 6.15 ± 0.15 at 10 GHz/23°C

Dissipation factor of 0.0027 at 10 GHz/23°C

Td > 500°C (TGA)

Moisture absorption of 0.05%

CTE X-axis: 47 ppm/°C, Y-axis: 34 ppm/°C, Z-axis: 117 ppm/°C

Clad with standard and reverse treated electrodeposited copper foil


3. Benefits of Rogers RT/duroid 6006 PCB

High dielectric constant for circuit size reduction

Low loss, ideal for operating at X-band or below

Tight εr and thickness control for repeatable circuit performance

Low moisture absorption

Reliable plated through-holes in multi-layer boards

Ease of fabrication and stability in use

Good thermal mechanical stability


4.Rogers RT/duroid 6006 PCB Construction Details

ItemSpecification
Base materialRogers RT/duroid 6006
Layer count2-layer rigid PCB
Board dimensions134.8mm x 78.65mm = 2 Types = 2 PCS, +/- 0.15mm
Minimum Trace/Space5/6 mils
Minimum Hole Size0.3mm
Blind viasNo
Finished board thickness0.4mm
Finished Cu weight1 oz (1.4 mils) outer layers
Via plating thickness20 μm
Surface finishImmersion Silver
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
100% Electrical testUsed prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm (1 oz)

RT/duroid 6006 Core - 0.254 mm (10 mil)

Copper_layer_2 - 35 μm (1 oz)


6. PCB Statistics

Components: 46

Total Pads: 64

Thru Hole Pads: 26

Top SMT Pads: 38

Bottom SMT Pads: 0

Vias: 41

Nets: 2


7. Primary Application Areas

Patch antennas

Satellite communications systems

Power amplifiers

Aircraft collision avoidance systems

Ground radar warning systems


8.Quality Assurance

Type of artwork supplied: Gerber RS-274-X (typical, not explicitly stated in source)

Accepted standard: IPC-Class-3

Availability: Worldwide


9. Rogers RT/duroid 6006 Ceramic-PTFE Laminate – Product Introduction

RT/duroid 6006 microwave laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15. RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. They have tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.


RT/duroid 6006 laminates are supplied clad on both sides with 1/2 oz. to 2 oz./ft² (18 to 70 μm) standard and reverse treated electrodeposited copper foil. Thick aluminum, brass, or copper plate on one side may be specified.


Standard tolerance dielectric thicknesses of 0.010", 0.025", 0.050", 0.075", and 0.100" (0.254, 0.635, 1.270, 1.905, 2.54 mm) are available. When ordering RT/duroid 6006 laminates, it is important to specify dielectric thickness and weight of copper foil required.



CCL 113 RTduroid 6006


10. Features and Benefits Summary

FeatureBenefit
Dk of 6.15 ± 0.15 at 10 GHz/23°CHigh dielectric constant for circuit size reduction
Dissipation factor of 0.0027 at 10 GHz/23°CLow loss, ideal for X-band or below
Tight εr and thickness controlRepeatable circuit performance
Td > 500°CExcellent thermal stability
Moisture absorption of 0.05%Stable performance in humid environments
CTE X:47, Y:34, Z:117 ppm/°CReliable plated through-holes in multi-layer boards
Standard and reverse treated ED copper foilDesign flexibility
Ceramic-PTFE compositeEase of fabrication and stability in use

11. Rogers RT/duroid 6006 Data Sheet

PropertyRT/duroid 6006DirectionUnitsConditionsTest Method
Dielectric Constant εr Process6.15 ± 0.15Z-10 GHz, 23°CIPC-TM-650 2.5.5.5 (Clamped stripline)
Dielectric Constant εr Design6.45Z-8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor, tan δ0.0027Z-10 GHz, 23°CIPC-TM-650 2.5.5.5
Thermal Coefficient of ε-410Zppm/°C-50°C to 170°CIPC-TM-650 2.5.5.5
Surface Resistivity7 × 10⁷-MohmCOND AIPC 2.5.17.1
Volume Resistivity2 × 10⁷-Mohm·cmCOND AIPC 2.5.17.1
Young's Modulus627 (91)XMPa (kpsi)AASTM D638
Young's Modulus517 (75)YMPa (kpsi)AASTM D638
Ultimate Stress20 (2.8)XMPa (kpsi)AASTM D638
Ultimate Stress17 (2.5)YMPa (kpsi)AASTM D638
Ultimate Strain12 to 13X%AASTM D638
Ultimate Strain4 to 6Y%AASTM D638
Compressive Young's Modulus1069 (155)ZMPa (kpsi)AASTM D695
Compressive Ultimate Stress54 (7.9)ZMPa (kpsi)AASTM D695
Compressive Ultimate Strain33Z%-ASTM D695
Flexural Modulus2634 (382)XMPa (kpsi)AASTM D790
Flexural Modulus1951 (283)YMPa (kpsi)AASTM D790
Flexural Ultimate Stress38 (5.5)X,YMPa (kpsi)AASTM D790
Deformation under load (24 hr/50°C/7MPa)0.33Z%24 hr/50°C/7MPaASTM D261
Deformation under load (24 hr/150°C/7MPa)2.10Z%24 hr/150°C/7MPaASTM D261
Moisture Absorption0.05-%D48/50°C, 0.050" (1.27mm) thickIPC-TM-650 2.6.2.1
Density2.7-g/cm³-ASTM D792
Thermal Conductivity0.49-W/(m·K)80°CASTM C518
CTE47Xppm/°C23°C/50% RHIPC-TM-650 2.4.41
CTE34Yppm/°C23°C/50% RHIPC-TM-650 2.4.41
CTE117Zppm/°C23°C/50% RHIPC-TM-650 2.4.41
Td500-°C TGA-ASTM D3850
Specific Heat0.97 (0.231)-J/g/K (BTU/lb/°F)-Calculated
Copper Peel Strength14.3 (2.5)-pli (N/mm)after solder floatIPC-TM-650 2.4.8
Flammability RatingV-0---UL 94
Lead-Free Process CompatibleYes----

12. Some Typical Applications

Patch antennas

Satellite communications systems

Power amplifiers

Aircraft collision avoidance systems

Ground radar warning systems


13. Standard Thicknesses, Panel Sizes & Claddings

Standard Thicknesses

ThicknessTolerance
0.010" (0.254 mm)Contact Rogers
0.025" (0.635 mm)+/- 0.0015"
0.050" (1.270 mm)+/- 0.0020"
0.075" (1.900 mm)+/- 0.0030"
0.100" (2.540 mm)Contact Rogers

Standard Panel Sizes

10" x 10" (254 mm x 254 mm)

10" x 20" (254 mm x 508 mm)

18" x 12" (457 mm x 305 mm)

Note: Additional panel sizes available.

Standard Claddings

Electrodeposited Copper Foil: ½ oz (18 μm) HH/HH, 1 oz (35 μm) H1/H1


 

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