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CLTE-XT 2-Layer Ultra-Thin 0.25mm High-Frequency PCB
PCB Material:Rogers CLTE-XT / 0.25mm finished thickness
MOQ:1PCS
Price:24.99-99 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:10-20 working days
Payment Method:T/T, Paypal
 

CLTE-XT 2-Layer Ultra-Thin 0.25mm PCB with Immersion Gold for RF and Antenna Applications


1.Introduction

Rogers CLTE-XT laminates are advanced composites of micro-dispersed ceramic filler, PTFE, and woven fiberglass reinforcement. They are engineered to improve loss tangent while providing the lowest insertion loss and highest degree of dimensional stability in their class. Building on the reliability of the CLTE laminates, CLTE-XT maintains its properties over an even wider temperature range, making it ideal for demanding RF and microwave applications.


2.Key Features

Composite material: Micro-dispersed ceramic filler, PTFE, and woven fiberglass
Dielectric Constant: 2.79 to 2.94 by thickness at 10GHz, 23°C @ 50% RH
Dissipation Factor: 0.0010 at 10GHz, 23°C @ 50% RH
CTE: X-axis 12.7 ppm/°C, Y-axis 13.7 ppm/°C, Z-axis 40.8 ppm/°C
Thermal Decomposition Temperature (Td): 539°C
Thermal Coefficient of Dielectric Constant: -8 ppm/°C
Tight dielectric constant tolerance: ±0.03
Low Moisture Absorption: 0.02%


3.Benefits

High plated through-hole reliability
Repeatable lot-to-lot performance
Reduced circuit losses without sacrificing dimensional stability
Dielectric constant stability with temperature change reduces stress attachment to ceramic active devices


CLTE-XT PCB


4.PCB Construction Details

ParameterSpecification
Base MaterialCLTE-XT
Layer Count2 layers
Board Dimensions63mm x 35mm (±0.15mm)
Min. Trace/Space5/6 mils
Min. Hole Size0.3mm
Blind ViasNo
Finished Thickness0.25mm
Cu Weight (Outer)1 oz (1.4 mils)
Via Plating Thickness20 μm
Surface FinishImmersion Gold
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% tested prior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
Rogers CLTE-XT Core - 0.129mm (5.1mil)
Copper_layer_2 - 35 μm


6.PCB Statistics:

Components: 6
Total Pads: 27
Thru Hole Pads: 15
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 8
Nets: 2


7.Typical Applications

Advanced Driver Assistance Systems (ADAS), Patch Antennas, Phased Array Antennas, Power Amplifiers, Ground-based and airborne communications and radar systems.


8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support


 

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