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3 Layer RO3006 Hybrid RF PCB with Blind Vias
PCB Material:Rogers RO3006 + Tg170 FR-4 / 0.86mm finished thickness
MOQ:1PCS
Price:34.99-129 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:12-22 working days
Payment Method:T/T, Paypal
 

3 Layer RO3006 Hybrid RF PCB 0.86mm with Blind Vias for Microwave Applications


1.Introduction

Rogers RO3006 laminates are ceramic-filled PTFE composites engineered to deliver outstanding electrical and mechanical stability, making them ideal for commercial microwave and RF applications. These advanced circuit materials provide a consistent dielectric constant (Dk) across varying temperatures, eliminating the Dk shift commonly found in PTFE glass materials near room temperature.


The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20. The dielectric loss is low, and the loss increases as the frequency increases, but the change is not significant within 10 GHz. The corresponding part numbers are TP300, TP440, TP600, TP615, TP920, TP960, TP980, TP1020 etc.


2.Key Features

Ceramic-filled PTFE composite material
Dielectric constant: 6.15 ± 0.15 at 10 GHz/23°C
Dissipation factor: 0.002 at 10 GHz/23°C
Thermal decomposition temperature (Td) > 500°C
Thermal conductivity: 0.79 W/mK
Moisture absorption: 0.02%
CTE (-55 to 288°C): X/Y 17 ppm/°C, Z 24 ppm/°C


3.Benefits

Uniform mechanical properties across a range of Dk values, ideal for multi-layer and hybrid PCB designs
Low in-plane CTE matches copper, enhancing reliability for surface-mounted assemblies
Excellent dimensional stability, suitable for temperature-sensitive applications
Cost-effective due to volume manufacturing processes


RO3006 Hybrid RF PCB


4.PCB Construction Details

ParameterSpecification
Base MaterialRO3006 + Tg170 FR-4
Layer Count3 layers
Board Dimensions98mm x 30mm (1PC)
Min. Trace/Space4/4 mils
Min. Hole Size0.3mm
Blind ViasTop-Inn1, Inn1-Bot
Finished Thickness0.86mm
Cu Weight (Inner)0.5 oz (0.7 mils)
Cu Weight (Outer)1 oz (1.4 mils)
Via Plating Thickness20 μm
Surface FinishOSP
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Profile FeatureStaircase
Electrical Test100% tested prior to shipment

5.PCB Stackup (3-Layer Rigid Structure)

Copper layer 1 - 35 μm
Rogers RO3006 - 10mil (0.254mm)
Copper layer 2 - 35 μm
Prepreg - 0.1mm
FR-4 Core Tg170 - 0.4mm
Copper_layer_3 - 35 μm


6.PCB Statistics:

Components: 12
Total Pads: 37
Thru Hole Pads: 21
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 39
Nets: 8


7.Typical Applications

Automotive radar, GPS antennas, cellular communication systems, patch antennas, direct broadcast satellites, datalink systems, remote meter readers, and power backplanes.


8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support


 

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