F4BM220 High-Performance 2-Layer PCB for Microwave and RF Applications

1.INTRODUCTION TO F4BM220

Wangling's F4BM220 laminates are developed through a precise formulation and pressing of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. Compared to F4B220, it offers improved electrical performance due to lower dielectric loss, higher insulation resistance, and enhanced stability, making it a suitable alternative to similar foreign products.

The F4BM220 and F4BME220 share the same dielectric layer but use different copper foil combinations: F4BM220 utilizes ED copper foil for applications without PIM requirements, while F4BME220 employs reverse-treated foil (RTF) for excellent PIM performance and reduced conductor loss.

By adjusting the ratio of PTFE to fiberglass cloth, both F4BM220 and F4BME220 achieve precise control over the dielectric constant, resulting in low loss and enhanced dimensional stability.

2.FEATURES OF F4BM220

Dielectric Constant (Dk): 2.2 ± 0.04 at 10GHz
Dissipation Factor: 0.001 at 10GHz
CTE:
X-axis: 25 ppm/°C
Y-axis: 34 ppm/°C
Z-axis: 240 ppm/°C (from -55°C to 288°C)
Thermal Coefficient of Dk: -142 ppm/°C (from -55°C to 150°C)
Moisture Absorption: ≤ 0.08%
Flammability Rating: UL-94 V0

3.PCB CONSTRUCTION DETAILS

4. PCB STACKUP

5. PCB STATISTICS

Components: 43
Total Pads: 94
Through-Hole Pads: 56
Top SMT Pads: 38
Bottom SMT Pads: 0
Vias: 51
Nets: 2

7.TYPICAL APPLICATIONS

Microwave, RF, and radar systems
Phase shifters
Power dividers, couplers, and combiners
Feed networks
Phase-sensitive and phased array antennas
Satellite communications
Base station antennas