F4BTMS430 2-Layer PCB: High-Performance Construction for Aerospace Applications

1. Introduction to F4BTMS

The F4BTMS series is an advanced version of the F4BTM series, showcasing significant improvements in material formulation and manufacturing processes. Enhanced with ceramics and ultra-thin glass fiber cloth, this high-reliability material is ideal for aerospace applications, offering a viable alternative to foreign products.

By integrating special nano-ceramics with polytetrafluoroethylene resin, it minimizes the negative effects of glass fiber on electromagnetic wave propagation, resulting in reduced dielectric loss and increased dimensional stability. The material supports a wider frequency range, improved electrical strength, and enhanced thermal conductivity, while maintaining a low thermal expansion coefficient.

The F4BTMS430 features RTF low roughness copper foil, which minimizes conductor loss and maximizes peel strength, suitable for both copper and aluminum bases.

2. Features of F4BTMS430

Dielectric Constant (Dk): 4.3 at 10GHz
Dissipation Factor: 0.0015 at 10GHz, 0.0019 at 20GHz
CTE x-axis: 13 ppm/°C, y-axis: 12 ppm/°C, z-axis: 47 ppm/°C (−55°C to 288°C)
Low Thermal Coefficient of Dk: -60 ppm/°C (−55°C to 150°C)
High Thermal Conductivity: 0.63 W/mk
Low Moisture Absorption: 0.08%

3.PCB Construction Details

4. PCB STACKUP

5. PCB STATISTICS

Components: 18
Total Pads: 51
Thru Hole Pads: 27
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 31
Nets: 2

6.ARTWORK AND QUALITY

Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide

7.Typical Applications

Aerospace equipment and cabin systems
Microwave and RF technologies
Radar systems, including military applications
Feed networks and phased array antennas
Satellite communications and more.