F4BTMS1000 PCB 2-Layer 6.35mm Thick High Thermal Conductivity for Aerospace and RF Feed Networks

1.Overview of the F4BTMS Series

The F4BTMS series represents an enhanced version of the F4BTM series, achieving significant advancements in material formulation and manufacturing processes. This upgraded material integrates a substantial amount of ceramics and is reinforced with ultra-thin, ultra-fine glass fiber cloth, leading to considerable improvements in performance and a wider range of dielectric constants. It is a highly reliable material ideal for aerospace applications and can effectively replace similar foreign products.

By using a minimal quantity of ultra-thin glass fiber cloth along with a large volume of uniformly distributed specialized nano-ceramics mixed with polytetrafluoroethylene resin, the series mitigates the negative impacts of glass fiber on electromagnetic wave propagation. This results in reduced dielectric loss, improved dimensional stability, and lower X/Y/Z anisotropy. Furthermore, it enhances the usable frequency range, electrical strength, and thermal conductivity, while also exhibiting a low thermal expansion coefficient and stable dielectric temperature characteristics.

A standard feature of the F4BTMS series is the RTF low roughness copper foil, which minimizes conductor loss and offers excellent peel strength. The material is compatible with both copper and aluminum substrates.

2. Features (F4BTMS1000)

Dielectric constant (Dk): 10.2 at 10GHz
Dissipation factor: 0.0020 at 10GHz; 0.0023 at 20GHz
Coefficient of Thermal Expansion (CTE):
- X-axis: 16 ppm/°C
- Y-axis: 18 ppm/°C
- Z-axis: 32 ppm/°C
Temperature range: -55°C to 288°C
Low thermal coefficient of Dk: -320 ppm/°C (from -55°C to 150°C)
High thermal conductivity: 0.81 W/mK
Low moisture absorption: 0.03%

3. PCB Stackup

Configuration: 2-layer rigid PCB
Copper Layer 1: 35 µm
F4BTMS1000 Core: 6.35 mm (250 mil)
Copper Layer 2: 35 µm

4. PCB Construction Details

Board dimensions: 98mm x 98mm (1 piece), ± 0.15mm tolerance
Minimum trace/space: 6/6 mils
Minimum hole size: 0.6mm
No blind vias
Finished board thickness: 6.4mm
Finished copper weight: 1 oz (1.4 mils) on outer layers
Via plating thickness: 20 µm
Surface finish: Bare copper
Top Silkscreen: White
Bottom Silkscreen: None
Top Solder Mask: None
Bottom Solder Mask: None
100% electrical testing conducted prior to shipment

5. PCB Statistics

Components: 28
Total Pads: 58
Through Hole Pads: 27
Top SMT Pads: 31
Bottom SMT Pads: 0
Vias: 35
Nets: 2

6.Type of Artwork Supplied

Gerber RS-274-X

7. Quality Standard

IPC-Class-2

8.Availability

Worldwide

9. Typical Applications

Aerospace equipment, space and cabin equipment
Microwave and RF applications
Radar and military radar systems
Feed networks
Phase-sensitive antennas and phased array antennas
Satellite communications, among others