F4BTMS233 PCB 2-Layer 40mil Low Loss Material for Microwave and Phased Array Antennas

1.F4BTMS Introduction

The F4BTMS series represents an advanced version of the F4BTM series, showcasing significant technological advancements in material formulation and manufacturing processes. This series features a material enriched with a considerable amount of ceramics and reinforced with ultra-thin, ultra-fine glass fiber cloth, leading to notable enhancements in material performance and a wider range of dielectric constants. It is a high-reliability material designed for aerospace applications and can serve as a substitute for similar foreign products.

By integrating a small quantity of ultra-thin, ultra-fine glass fiber cloth with a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the adverse effects of glass fiber on electromagnetic wave propagation are reduced. This innovation minimizes dielectric loss, enhances dimensional stability, and lowers the X/Y/Z anisotropy of the material. Additionally, it expands the usable frequency range, improves electrical strength, and boosts thermal conductivity. The material also features a low thermal expansion coefficient and stable dielectric temperature characteristics.

The F4BTMS series includes RTF low roughness copper foil as a standard feature, which decreases conductor loss and provides excellent peel strength. It is compatible with both copper and aluminum bases.

2. Features (F4BTMS233)

Dielectric constant (Dk) of 2.33 at 10GHz
Dissipation factor of 0.0010 at 10GHz and 0.0011 at 20GHz
Coefficient of thermal expansion (CTE):
x-axis: 35 ppm/°C
y-axis: 40 ppm/°C
z-axis: 220 ppm/°C (from -55°C to 288°C)
Low thermal coefficient of Dk at -122 ppm/°C (from -55°C to 150°C)
UL-94 V0 rated
Low moisture absorption of 0.02%

3.PCB Stackup: 2-Layer Rigid PCB

Copper Layer 1: 35 µm
F4BTMS233 Core: 1.016 mm (40 mil)
Copper Layer 2: 35 µm

4. PCB Construction Details

Board Dimensions: 40mm x 108mm (1 piece, +/- 0.15mm)
Minimum Trace/Space: 5/4 mils
Minimum Hole Size: 0.3 mm
No blind vias
Finished Board Thickness: 1.1mm
Finished Copper Weight: 1oz (1.4 mils) on outer layers
Via Plating Thickness: 20 µm
Surface Finish: OSP
Top Silkscreen: White
Bottom Silkscreen: None
Top Solder Mask: Blue
Bottom Solder Mask: None
100% electrical testing conducted prior to shipment

5.PCB Statistics

Components: 27
Total Pads: 62
Through Hole Pads: 36
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 41
Nets: 2

6.Type of Artwork Supplied

Gerber RS-274-X

7. Quality Standard

IPC-Class-2

8.Availability

Worldwide

9. Typical Applications

Aerospace equipment, space and cabin equipment
Microwave and RF applications
Radar and military radar systems
Feed networks
Phase-sensitive antennas and phased array antennas
Satellite communications, among others