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F4BTMS1000 Aerospace PCB
PCB Material:F4BTMS1000 / 0.6mm
MOQ:1PCS
Price:19.99-109 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:10-18 working days
Payment Method:T/T, Paypal
 

F4BTMS1000 PCB High-Performance 2-Layer Rigid PCB for Aerospace Applications


1. F4BTMS Introduction

The F4BTMS series is an advanced version of the F4BTM series, featuring significant improvements in material formulation and manufacturing processes. This material integrates a high percentage of ceramics and ultra-thin glass fiber cloth, enhancing performance and offering a wider range of dielectric constants. It is particularly suitable for aerospace applications and can replace similar foreign products.


The incorporation of ultra-thin glass fiber and uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin minimizes the negative effects of glass fiber on electromagnetic wave propagation, reducing dielectric loss and enhancing dimensional stability. This innovation increases the usable frequency range, improves electrical strength, and enhances thermal conductivity while exhibiting low thermal expansion and stable dielectric characteristics.


The F4BTMS series features RTF low roughness copper foil, which reduces conductor loss and provides excellent peel strength. It is compatible with both copper and aluminum bases.


2. Features of F4BTMS1000

Dielectric Constant (Dk): 10.2 at 10GHz
Dissipation Factor: 0.0020 at 10GHz, 0.0023 at 20GHz
CTE (Coefficient of Thermal Expansion):
x-axis: 16 ppm/°C
y-axis: 18 ppm/°C
z-axis: 32 ppm/°C (-55°C to 288°C)
Low Thermal Coefficient of Dk: -320 ppm/°C (-55°C to 150°C)
High Thermal Conductivity: 0.81 W/mk
Low Moisture Absorption: 0.03%



3.PCB Construction Details

SpecificationDetails
Base Material F4BTMS1000
Layer Count 2 layers
Board Dimensions 85mm x 40mm (1 piece, +/- 0.15mm)
Minimum Trace/Space 4/4 mils
Minimum Hole Size 0.3mm
Blind Vias None
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (1.4 mils) on outer layers
Via Plating Thickness 20 µm
Surface Finish OSP
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical Testing 100% electrical test prior to shipment

4. PCB STACKUP

LayerDetails
Copper Layer 135 µm
F4BTMS1000 Core0.508 mm (20 mil)
Copper Layer 235 µm

5. PCB STATISTICS

Components: 21
Total Pads: 60
Through-Hole Pads: 33
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 41
Nets: 2


6.ARTWORK AND QUALITY

Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide


7. Typical Applications

Aerospace equipment and cabin systems
Microwave and RF applications
Military radar and feed networks
Phase-sensitive and phased array antennas
Satellite communications and more


 

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