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HDI PCB – 8-Layer 1.5mm Thick with TU-883 Material for High-Speed, Low-Loss Applications
1.Introduction of TU-883 (ThunderClad 2)
TU-883 (ThunderClad 2) is a high-performance, low-loss material designed for high-speed, radio frequency, and wireless applications. Reinforced with woven E-glass, it features a low dielectric constant (Dk) and dissipation factor (Df), making it ideal for environmentally friendly lead-free processes. TU-883 is compatible with FR-4 processes and offers excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, and anti-CAF capability.
2.Key Features of TU-883
High Tg (TMA): 170°C
Dielectric Constant (Dk): 3.39 @ 10 GHz
Dissipation Factor (Df): 0.0045 @ 10 GHz
Stable Dk/Df Performance: Consistent across frequency and temperature
Compatibility: Modified FR-4 processes
Moisture Resistance: Excellent performance in humid environments
Lead-Free Reflow Process: Fully compatible
Improved Z-Axis Thermal Expansion: Enhanced reliability
Anti-CAF Capability: Prevents conductive anodic filament formation
Through-Hole and Soldering Reliability: Excellent performance
Halogen-Free: Meets environmental standards
3. Basic PCB Specifications
| Parameter | Specification |
| Board Type | 8-layer rigid PCB |
| Material Type | TU-883 (ThunderClad 2) |
| Solder Mask | Blue (both sides) |
| Silkscreen Print | White (top side) |
| Surface Finish | ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| Total Board Thickness | 1.45mm ±10% |
| Board Size | 97.3mm x 67.7mm = 1PCS |
| Minimum Hole Size | 0.25mm |
| Solder Mask Thickness | 10µm |
| Minimum Dielectric Thickness | 100µm |
| Minimum Trace Line Width | 150µm |
| Minimum Spacing | 160µm |
| Blind Vias | Yes, L1-L2, L7-L8 |
| Buried Vias | Yes, L2-L7 |
| Back-Drilled Vias | Yes, L1-L6 |
| Impedance Control | |
| - 100Ω Differential Pairs | Top layer, 4mil/5mil trace/gap, reference layer 2 |
| - 90Ω Differential Pairs | Bottom layer, 4mil/7mil trace/gap, reference layer 7 |
| - 50Ω Differential Pairs | Layer 6, 5mil/6mil trace/gap, reference layers 5 and 7 |
| Counterholes | Applied on the top layer, 90 degrees, 0.5mm deep |
| Edge Plating | Applied on designated areas |
4.PCB Stack-Up: 8-Layer Rigid PCB (Component Side at Top)
| Material | Copper Layer | Thickness (µm) | Specification |
| Copper | 1 | 45 | 18µm base + 17µm plating |
| TUC-TU883P | Prepreg | 89 | IPC-4101/24 |
| Copper | 2 | 35 | |
| S1000-2MB | Prepreg | 160 | IPC-4101/24 |
| Copper | 3 | 35 | |
| FR-4 TU883 | Core | 254 | IPC-4101/24 |
| Copper | 4 | 35 | |
| S1000-2MB | Prepreg | 160 | IPC-4101/24 |
| Copper | 5 | 35 | |
| FR-4 TU883 | Core | 254 | IPC-4101/24 |
| Copper | 6 | 35 | |
| S1000-2MB | Prepreg | 160 | IPC-4101/24 |
| Copper | 7 | 35 | |
| TUC-TU883P | Prepreg | 89 | IPC-4101/24 |
| Copper | 8 | 35 | 18µm base + 17µm plating |
5.PCB Statistics:
Components: 49
Total Pads: 98
Thru-Hole Pads: 46
Top SMT Pads: 38
Bottom SMT Pads: 14
Vias: 63
Nets: 6
6.Additional Details
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
7.Typical Applications
Radio Frequency (RF) Systems
Backplanes and High-Performance Computing
Line Cards and Storage Systems
Servers, Telecom, and Base Stations
Office Routers
8.Upgrade Your High-Speed PCB Designs with TU-883!
Whether you're working on RF systems, telecom infrastructure, or high-performance computing, TU-883 HDI PCBs offer the perfect combination of performance, reliability, and cost efficiency. With low dielectric loss, impedance-controlled design, and excellent thermal stability, TU-883 is the ideal choice for your next high-speed PCB project.
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