High-Frequency RO4350B 2-Layer PCB with ENIG Finish

1.Introduction

Rogers RO4350B is a high-performance, cost-effective laminate designed for RF and microwave applications. Combining the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass, this material offers tight dielectric constant (Dk) control and low loss, making it ideal for cellular base stations, automotive radar, and satellite communications. With excellent dimensional stability and compatibility with FR-4 processing, RO4350B reduces fabrication costs without compromising performance.

2.Key Features

Dielectric Constant (Dk): 3.48 ± 0.05 @ 10 GHz/23°C
Low Dissipation Factor (Df): 0.0037 @ 10 GHz/23°C
High Thermal Stability: Tg >280°C, CTE matched to copper (X:10, Y:12, Z:32 ppm/°C)
Thermal Conductivity: 0.69 W/m·K
Moisture Resistance: 0.06% absorption
UL 94 V-0 Rated: Suitable for high-power RF designs

3.PCB Construction Details

4.PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm
Rogers RO4350B Core - 0.168 mm (6.6mil)
Copper_layer_2 - 35 μm

5.Board Statistics

Components: 2
Pads: 13 (9 thru-hole, 4 SMT)
Vias: 7
Nets: 2

6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping

7.Benefits

Cost-Effective RF Solution – Processes like FR-4 with superior RF performance.
Excellent Dimensional Stability – CTE matched to copper for reliable multilayer designs.
High Thermal Reliability – Withstands severe thermal shock conditions.
UL 94 V-0 Certified – Safe for high-power and active RF devices.

8.Target Applications

5G & Cellular Base Stations (Antennas, Power Amplifiers)
Automotive Radar & Sensors (ADAS, mmWave)
RFID Tags & IoT Devices
Satellite Communications (LNB, DBS)