RT/duroid 6035HTC 2-Layer High-Power RF PCB with ENIG Finish

1.Product Overview: High-Thermal-Conductivity RF Substrate

RT/duroid 6035HTC is a ceramic-filled PTFE composite material engineered for high-power RF/microwave applications. With higher thermal conductivity than standard RT/duroid 6000 series, this double-sided PCB delivers exceptional heat dissipation while maintaining stable electrical performance. The immersion silver finish and 4/7 mil trace spacing make it ideal for power amplifiers, combiners, and other high-frequency circuits.

2.Key Material Properties

Dielectric Constant: 3.5 ±0.05 @ 10GHz
Ultra-Low Loss: 0.0013 dissipation factor @ 10GHz
Enhanced Thermal Management: 1.44 W/m/K conductivity
Temperature Stable: -66 ppm/°C ΔDk
Moisture Resistant: 0.06% absorption
CTE Matched: 19/19/39 ppm/°C (X/Y/Z)

3.PCB Construction Details

4.PCB Stackup: 2-layer rigid PCB

35μm Copper
1.524mm (60mil) 6035HTC Core
35μm Copper

5.Board Statistics

Components: 16
Total Pads: 51
Thru Hole Pads: 37
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 71
Nets: 2

6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping

7.Benefits

High Thermal conductivity
Improved dielectric heat dissipation enables lower operating temperatures for high power applications
Excellent high frequency performance
Lower insertion loss and excellent thermal stability of traces

8.Target Applications

High power RF and microwave amplifiers
Power amplifiers, couplers, filters, combiners, power dividers