RF-60TC High Frequency PCB - 2-Layer Rigid PCB with Immersion Gold Finish

1. Introduction of RF-60TC

RF-60TC is a high-frequency material that features excellent thermal conductivity, combining ceramic-filled, glass-reinforced PTFE laminate for high-power RF and microwave applications. It is specifically engineered to operate at lower temperatures in demanding applications while enhancing gains and efficiencies in miniaturized antenna designs within the 6.15 DK market. This is achieved through improved dielectric heat dissipation and exceptionally low dielectric losses.

The superior heat transfer properties of RF-60TC provide additional design margins, extending the lifespan of active components and improving long-term reliability. Furthermore, RF-60TC exhibits excellent adhesion to low-profile and reverse-treated copper, minimizing insertion loss. Its low coefficient of thermal expansion (CTE) and enhanced dimensional stability facilitate the construction of high layer count multilayer PCBs with improved plated through-hole reliability.

2. Features

Glass-reinforced PTFE ceramic composites
Dielectric constant (Dk) of 6.15 at 10 GHz
Dissipation factor of 0.002 at 10 GHz and 23°C
Thermal coefficient of Dk of -3.58 ppm/°C over the range of -50°C to 150°C
Low moisture absorption of 0.03%
High thermal conductivity of 0.9 W/m*K (unclad), 1.0 W/m*K (0.5 oz), 1.05 W/m*K (1 oz)
CTE values of 9.9 ppm/°C in the X and Y axes, and 40 ppm/°C in the Z-axis

3. Benefits

Improved loss tangent
High thermal conductivity
Enhanced dimensional stability
Low Z-axis CTE of 40 ppm/°C
Excellent adhesion to metals
Stable dielectric constant over frequency
Stable dielectric constant over temperature
Low moisture absorption

4. PCB Stackup: 2-Layer Rigid PCB
Copper Layer 1: 70 µm
RF-60TC Core: 0.508 mm (20 mil)
Copper Layer 2: 70 µm

5. PCB Construction Details

Board dimensions: 200 mm x 62 mm (1 piece), +/- 0.15 mm
Minimum trace/space: 4/5 mils
Minimum hole size: 0.2 mm
No blind vias
Finished board thickness: 0.6 mm
Finished copper weight: 1 oz (1.4 mils) for outer layers
Via plating thickness: 20 µm
Surface finish: Immersion gold
Top silkscreen: White
Bottom silkscreen: None
Top solder mask: Green
Bottom solder mask: None
100% electrical testing conducted prior to shipment

6. PCB Statistics
Components: 44
Total pads: 99
Through-hole pads: 68
Top SMT pads: 31
Bottom SMT pads: 0
Vias: 47
Nets: 2

7. Type of Artwork Supplied
Gerber RS-274-X

8. Accepted Standard
IPC-Class-2

9. Availability
Worldwide

10. Some Typical Applications

High-power amplifiers
Miniaturized antennas
GPS, patch antennas, RFID readers
Filters, couplers, and dividers
Satellite communications