RO4003C 4-Layer 4.8mm Thick PCB with ENIG Finish and Countersunk Holes – Applications and Process Overview1.Introduction of RO4003C Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Available in various configurations using 1080 and 1674 glass fabric styles, RO4003C laminates deliver consistent dielectric constant (Dk) and low loss characteristics. They can be processed using standard epoxy/glass methods, offering a cost-effective alternative to traditional microwave laminates without requiring special through-hole treatments. RO4003C materials are non-brominated and not UL 94 V-0 rated. Their thermal expansion coefficient (CTE) closely matches that of copper, ensuring excellent dimensional stability and reliable plated through-hole integrity even under severe thermal conditions. With a Tg exceeding 280°C, RO4003C maintains stable expansion properties throughout circuit processing.
2.Key Features Dielectric Constant: 3.38 ±0.05 at 10 GHz 3.Benefits Ideal for multi-layer board (MLB) constructions
4.PCB Construction Details
5.PCB Stackup (4-Layer Rigid Structure) Copper_layer_1 - 35 μm
6.PCB Statistics: Components: 2 7.Typical Applications Cellular Base Station Antennas and Power Amplifiers 8.Quality Assurance Artwork Format: Gerber RS-274-X |
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