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RO4350B 6-Layer 1.6mm PCB with ENIG and Blind Vias
PCB Material:Rogers RO4350B / 1.6mm finished thickness
MOQ:1PCS
Price:4.99-149 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

RO4350B 6-Layer 1.6mm PCB with ENIG & Blind Vias for RF/Microwave Applications


1.Introduction of RO4350B

Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics that offer electrical performance close to PTFE/woven glass along with the manufacturability of epoxy/glass. These laminates provide tight control over dielectric constant (Dk) and maintain low loss characteristics, while being processed using standard epoxy/glass methods. RO4350B materials are available at a fraction of the cost of conventional microwave laminates and do not require special through-hole treatments or handling procedures like PTFE-based materials. They are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs. The thermal expansion coefficient (CTE) of RO4350B is similar to that of copper, ensuring excellent dimensional stability—a critical property for mixed dielectric multi-layer boards. The low Z-axis CTE guarantees reliable plated through-hole quality even under severe thermal shock conditions. With a Tg exceeding 280°C, RO4350B maintains stable expansion properties across all circuit processing temperatures.


2.Key Features

Dielectric Constant: 3.48 ±0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Conductivity: 0.69 W/m/°K
CTE: X: 10 ppm/°C, Y: 12 ppm/°C, Z: 32 ppm/°C
High Tg: >280°C
Low Water Absorption: 0.06%
UL 94 V-0 Rated


3.Benefits

Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower fabrication cost
Excellent dimensional stability
Competitively priced


RO4350B 6-Layer PCB


4.PCB Construction Details

ParameterSpecification
Base MaterialRO4350B
Layer Count6-layer
Board Dimensions110mm x 80mm (±0.15mm)
Min. Trace/Space4/4 mils
Min. Hole Size0.3mm
Blind ViasL1-L4, L5-L6
Finished Thickness1.6mm
Cu Weight (Inner/Outer)1oz (35μm)
Via Plating Thickness20 μm
Surface FinishElectroless Nickel Immersion Gold (ENIG)
Top/Bottom SilkscreenWhite
Top/Bottom Solder MaskGreen
Electrical Test100%

5.PCB Stackup (6-Layer Rigid Structure)

Copper_layer_1 - 35 μm
Rogers RO4350B Core - 0.254 mm (10mil)
Copper_layer_2 - 35 μm
Prepreg RO4450F X 2 - 0.2mm
Copper_layer_3 - 35 μm
Rogers RO4350B Core - 0.508 mm (20mil)
Copper_layer_4 - 35 μm
Prepreg RO4450F X 2 - 0.2mm
Copper_layer_5 - 35 μm
Rogers RO4350B Core - 0.254 mm (10mil)
Copper_layer_6 - 35 μm


6.PCB Statistics:

Components: 28
Total Pads: 120
Thru Hole Pads: 96
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 455
Nets: 12


7.Typical Applications

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites


8.Quality Assurance

Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


 

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