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RO4360G2 2-Layer 32mil ENIG PCB
PCB Material:Rogers RO4360G2 / 0.9mm (32mil core)
MOQ:1PCS
Price:4.99-129 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

RO4360G2 2-Layer 32mil ENIG PCB for Base Station Amplifiers


1. Introduction of RO4360G2

Rogers RO4360G2 laminates are low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing capability. RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4. These materials are lead-free process capable and offer better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 laminates can be paired with RO440 series prepreg and lower-Dk RO4000 laminate in multi-layer designs.


2. Key Features

High Dielectric Constant: 6.15 ±0.15 at 10 GHz/23°C
Low Loss Performance: Dissipation factor of 0.0038 at 10 GHz/23°C
High Temperature Performance: Td > 407°C, High Tg greater than 280°C TMA
Effective Thermal Management: High Thermal Conductivity of 0.75 W/mK
Excellent Reliability: Low Z-axis coefficient of thermal expansion at 28 ppm/°C
Dimensional Stability: Copper matched CTE X-axis 13 ppm/°C, Y-axis 14 ppm/°C (-55 to 288°C)
Modern Compliance: Lead free Process Compatible, 94V-0 flammability


3. Benefits

Design Versatility: Design flexibility for various applications
Enhanced Reliability: Plated through-hole reliability
Manufacturing Efficiency: Automated assembly compatible
Environmental Responsibility: Environmentally friendly - Lead free process compatible
Cost Effectiveness: Efficient supply chain and short lead times makes for cost effective material option


RO4360G2 PCB


4. PCB Construction Details

ParameterSpecification
Base MaterialRO4360G2
Layer Count2 layers
Board Dimensions73.12mm × 44.71mm = 1PC
Minimum Trace/Space5/6 mils
Minimum Hole Size0.30mm
Blind ViasNo
Finished Board Thickness0.9mm
Finished Cu Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Gold
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskGreen
Bottom Solder MaskNo
Electrical Test100% tested prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper Layer 1 - 35 μm
Rogers RO4360G2 Substrate - 32mil (0.813mm)
Copper Layer 2 - 35 μm


6. PCB Statistics:

Components: 16
Total Pads: 53
Thru Hole Pads: 37
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 49
Nets: 2


7. Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers


8. Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide


 

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