RO4360G2 2-Layer 32mil ENIG PCB for Base Station Amplifiers1. Introduction of RO4360G2 Rogers RO4360G2 laminates are low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing capability. RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4. These materials are lead-free process capable and offer better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 laminates can be paired with RO440 series prepreg and lower-Dk RO4000 laminate in multi-layer designs. 2. Key Features High Dielectric Constant: 6.15 ±0.15 at 10 GHz/23°C 3. Benefits Design Versatility: Design flexibility for various applications
4. PCB Construction Details
5. PCB Stackup (2-Layer Rigid Structure) Copper Layer 1 - 35 μm 6. PCB Statistics: Components: 16 7. Typical Applications Base Station Power Amplifiers 8. Quality Assurance Artwork Format: Gerber RS-274-X |
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