RT/duroid 6035HTC 2-Layer 0.8mm ENIG PCB for High-Power RF/Microwave Applications

1.Introduction

Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. They are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.

2.Key Features

DK of 3.5 +/- 0.05 at 10 GHz/23°C
Dissipation factor of 0.0013 at 10 GHz/23°C
Thermal Coefficient of dielectric constant of -66 ppm/°C
Moisture Absorption 0.06%
High Thermal Conductivity of 1.44 W/m/K at 80°C
CTE in X-axis of 19 ppm/°C, Y-axis of 19ppm/°C and Z-axis of 39ppm/°C
UL 94-V0 Flammability
Lead-free Process Compatible

3.Benefits

High Thermal conductivity
Improved dielectric heat dissipation enables lower operating temperatures for high power applications
Excellent high frequency performance
Lower insertion loss and excellent thermal stability of traces

4.PCB Construction Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 - 35 μm
RT/duroid 6035HTC - 0.762 mm (30mil)
Copper layer 2 - 35 μm

6.PCB Statistics:

Components: 19
Total Pads: 53
Thru Hole Pads: 31
Top SMT Pads: 22
Bottom SMT Pads: 0
Vias: 33
Nets: 2

7.Typical Applications

High power RF and microwave amplifiers
Power amplifiers, couplers, filters, combiners, power dividers

8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support